Abstract: An improvement to a semi-autonomous apparatus is described herein. In an apparatus having a gantry subassembly, a tram subassembly movably mounted on the gantry subassembly, and an actuation subassembly mounted on the tram subassembly, the improvement includes a gripper subassembly operatively connected to the actuation subassembly. The movement of the subassemblies is controlled in part by a control system that controls drive systems associated with one or more of the subassemblies. The gantry subassembly includes a bridge member for laterally spanning a selected section of a work site. The tram subassembly includes a tram that travels laterally along to the bridge member. The actuation subassembly includes at least one motion actuator for controlling the movement of the gripper subassembly in a generally vertical direction and may include an additional motion actuator for movement in a generally horizontal direction.

Abstract: A probe card array check plate is provided with transition zones to prevent a semi-conductor probe from impacting an epoxy joint in the check plate during an over travel test. The transition zone is in the form of beveled edges or tapers between first and second testing surfaces. In alternate embodiments, two or more different types of testing surfaces are juxta positioned, or an optical measurement window is made sufficiently large to prevent an over traveling probe tip from entering an epoxied area.

Abstract: A high accuracy, orthogonal motion stage for microscopes and the like uses three frames for orthogonal motion. The lower most frame has provided thereon a series of downwardly depending ramps. An actuator plate having correspondingly positioned, upwardly directed ramps is translated with respect to the lower most frame to raise and lower the frames.

Abstract: A method and apparatus for inspecting integrated circuit probe cards in which the probe points of the probe card are scanned across a checkplate having a conductivity transition border. The impedances between the probe points and the checkplate as they cross the conductivity transition border are measured to determine when the probe points cross the border. The positions of the probe card when each of the probe points crosses the border are measured to determine the positions of the probe points relative to each other. In one embodiment, the checkplate is formed by a square conductive plate having three quadrants of insulated material and a single quadrant of conductive material mounted on its upper surface. These conductive strips connected to the conductive plate are positioned between the quadrants of insulative material to form the conductivity transition border. In other embodiments, multiple parallel strips or a single dot of conductive material are surrounded by insulative material.

Abstract: A method and apparatus for inspecting integrated circuit probe cards in which the probe points of the probe card are scanned across a checkplate having a conductivity transition border. The impedances between the probe points and the checkplate as they cross the conductivity transition border are measured to determine when the probe points cross the border. The positions of the probe card when each of the probe points crosses the border are measured to determine the positions of the probe points relative to each other. In one embodiment, the checkplate is formed by a square conductive plate having three quadrants of insulated material and a single quadrant of conductive material mounted on its upper surface. These conductive strips connected to the conductive plate are positioned between the quadrants of insulative material to form the conductivity transition border. In other embodiments, multiple parallel strips or a single dot of conductive material are surrounded by insulative material.

Abstract: A method and apparatus for inspecting integrated circuit probe cards in which the probe points of the probe card are scanned across a checkplate having a conductivity transition border. The impedances between the probe points and the checkplate as they cross the conductivity transition border are measured to determine when the probe points cross the border. The positions of the probe card when each of the probe points crosses the border are measured to determine the positions of the probe points relative to each other. In one embodiment, the checkplate is formed by a square conductive plate having three quadrants of insulated material and a single quadrant of conductive material mounted on its upper surface. These conductive strips connected to the conductive plate are positioned between the quadrants of insulative material to form the conductivity transition border. In other embodiments, multiple parallel strips or a single dot of conductive material are surrounded by insulative material.