Abstract: The present disclosure is directed to a medical device. The medical device can include a first end having a first aperture, a first biasing member, a second aperture, and a second biasing member. Each of the first aperture and the second aperture can receive a portion of a bone component. The medical device can include a second end having a tensioning member that can apply force to at least a portion of the bone component.

Abstract: A method of forming a heat-treated liquid nutritional composition having a neutral pH and comprising a water-insoluble plant flavonoid comprises providing an aqueous liquid nutritional composition having a pH of from about 6 to about 7.5 and comprising protein, fat, carbohydrate, and water-insoluble plant flavonoid, homogenizing the liquid nutritional composition at a pressure of at least about 2000 psi, and heat treating the liquid nutritional composition. A heat-treated liquid nutritional composition having a pH of from about 6 to about 7.5 comprises a water-insoluble plant flavonoid, protein, fat and carbohydrate. At least about 75 wt % of the water-insoluble plant flavonoid remains suspended throughout the liquid nutritional composition after two months of storage at room temperature.

Abstract: This disclosure describes methods to separate solids from liquids in a production facility. A process separates components in the process stream by applying non-condensable media to create density differences and then using a mechanical device to separate the solids from the liquids based on the density difference. The process produces the liquids and solids, which may be further processed to create valuable animal feed products.

Abstract: A method of forming a solder composition comprises mixing indium, nickel, copper, silver, antimony, zinc, and tin together to form an alloy that consists of about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper. about 0.03% to about 4% by weight nickel, about 0.03% to about 1.5% by weight zinc, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The solder composition formed by this method can be used to solder an electrical connector to an electrical contact surface on a glass component.

Abstract: A method of forming a solder composition comprises mixing indium, nickel, copper, silver, antimony, zinc, and tin together to form an alloy that consists of about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper. about 0.03% to about 4% by weight nickel, about 0.03% to about 1.5% by weight zinc, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The solder composition formed by this method can be used to solder an electrical connector to an electrical contact surface on a glass component.

Abstract: A pre-soldered pre-fluxed electrical component or connector, which can protect the flux from wearing off the surface of solder during shipping and handling. The electrical component can include a terminal pad. A layer of solder can be on the terminal pad. The layer of solder can have a surface with a series of generally equally spaced apart flux wells formed in the surface of the solder for protectively storing and retaining flux therein. The flux wells can have a lateral dimension of at least 0.05 mm and a depth of at least 0.023 mm that is deep enough for retaining a quantity of flux therein when flux on the surface of the layer of solder wears off during shipping and/or handling.

Abstract: Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. Methods of forming the alloys are also described herein.

Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

Abstract: A presoldered prefluxed electrical component or connector, which can protect the flux from wearing off the surface of solder during shipping and handling. The electrical component can include a terminal pad. A layer of solder can be on the terminal pad. The layer of solder can have a surface with a series of generally equally spaced apart flux wells formed in the surface of the solder for protectively storing and retaining flux therein. The flux wells can have a lateral dimension of at least 0.05 mm and a depth of at least 0.023 mm that is deep enough for retaining a quantity of flux therein when flux on the surface of the layer of solder wears off during shipping and/or handling.

Abstract: The present invention relates to an insecticidal enriched extract (biopesticide) isolated from the stem of Nothapodites foetida (Wight) Sleumer (formerly Mappia foetida (Miers) useful for the insect free storage and transport of grains and seed. The insecticidal activity of the enriched extract (biopesticide) of the invention is ascribed to compound/s other than camptothecin. The invention further relates to the process for preparation thereof, containing Compounds of general formula 1 and formula 2 (General formula 1) wherein R1=CH3, CH2OAC and wherein R2=COOH, or (I) and R3=H. OH.

Abstract: Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. Methods of forming the alloys are also described herein.

Abstract: A solder composition includes about 20% to about 25% by weight tin, about 0.03% to about 3% by weight nickel, about 66% to about 75% by weight indium, and about 0.5% to about 2% by weight silver. The solder composition can further include about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.2% to about 6% by weight zinc, and/or about 0.01% to about 0.3% by weight germanium. The solder composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

Abstract: A loading basket is secured at its proximal end to a portion of a delivery device. The stent engages with the interior of the stent basket when loaded onto the delivery device to prevent shifting or movement of the stent during delivery of the stent to a desired location within the bodily lumen. In at least one embodiment, the loading basket has a proximal end, a distal end, and a braided surface. The loading basket comprises a proximal end portion, a proximal transition portion, a body portion, a distal transition portion, a distal end portion, and an angled inward distal end. When loaded onto the delivery device, the outer surface of the stent contacts at least the angled inward distal end of the delivery device and movement of the stent is prevented.

Abstract: A presoldered prefluxed electrical component or connector, which can protect the flux from wearing off the surface of solder during shipping and handling. The electrical component can include a terminal pad. A layer of solder can be on the terminal pad. The layer of solder can have a surface with a series of generally equally spaced apart flux wells formed in the surface of the solder for protectively storing and retaining flux therein. The flux wells can have a lateral dimension of at least 0.05 mm and a depth of at least 0.023 mm that is deep enough for retaining a quantity of flux therein when flux on the surface of the layer of solder wears off during shipping and/or handling.

Abstract: The present invention relates to an insecticidal enriched extract (biopesticide) isolated from the stem of Nothapodites foetida (Wight) Sleumer (formerly Mappia foetida (Miers) useful for the insect free storage and transport of grains and seed. The insecticidal activity of the enriched extract (biopesticide) of the invention is ascribed to compound/s other than camptothecin. The invention further relates to the process for preparation thereof, containing Compounds of general formula 1 and formula 2 (General formula 1) wherein R1=CH3, CH2OAC and wherein R2=COOH, or (I) and R3=H. OH.

Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

Abstract: An apparatus for presoldering electrical components can include a die device having a punch member for punching a solder preform from a sheet of solder, and pressing the solder preform against an electrical component. A heating device can press against the electrical component on a opposite side from the die device for sandwiching the electrical component between the punch member and the heating member, for heating the electrical component and melting the solder preform thereon.

Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

Abstract: A loading basket is secured at its proximal end to a portion of a delivery device. The stent engages with the interior of the stent basket when loaded onto the delivery device to prevent shifting or movement of the stent during delivery of the stent to a desired location within the bodily lumen. In at least one embodiment, the loading basket has a proximal end, a distal end, and a braided surface. The loading basket comprises a proximal end portion, a proximal transition portion, a body portion, a distal transition portion, a distal end portion, and an angled inward distal end. When loaded onto the delivery device, the outer surface of the stent contacts at least the angled inward distal end of the delivery device and movement of the stent is prevented.