Patents by Inventor John Pitten

John Pitten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240097360
    Abstract: A modular high speed, high density electrical connector configurable for use in multiple configurations, including a direct attach orthogonal configuration. The connector is assembled with modules that include shielded pairs of signal conductors with mating ends that are rotated approximately 45 degrees with respect to intermediate portions of the signal conductors. The connector may have a mating interface with receptacles in one connector and pins in the mating connector. The pins may be small diameter and may be implemented with superelastic wires so as to resist damage despite having very small effective diameter. A compact mating interface resulting from small diameter mating contact portions may enable other portions of the connector, including the shielding surrounding the signal conductors to be smaller, which may raise the resonant frequency of the connector and extend its bandwidth.
    Type: Application
    Filed: June 22, 2023
    Publication date: March 21, 2024
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, John Pitten
  • Patent number: 11742601
    Abstract: A modular high speed, high density electrical connector configurable for use in multiple configurations, including a direct attach orthogonal configuration. The connector is assembled with modules that include shielded pairs of signal conductors with mating ends that are rotated approximately 45 degrees with respect to intermediate portions of the signal conductors. The connector may have a mating interface with receptacles in one connector and pins in the mating connector. The pins may be small diameter and may be implemented with superelastic wires so as to resist damage despite having very small effective diameter. A compact mating interface resulting from small diameter mating contact portions may enable other portions of the connector, including the shielding surrounding the signal conductors to be smaller, which may raise the resonant frequency of the connector and extend its bandwidth.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: August 29, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, John Pitten
  • Publication number: 20230187861
    Abstract: A dense, high-speed interconnection may be formed with a mating header and receptacle connector. The header connector may have groups of mating contact portions extending from the connector housing. Structural projections may extend from the housing adjacent some or all of the groups of mating contact portions. The groups of mating contact portions may be signal and ground mating contact portions associated with a signal pair. The groups may be arranged in an array and the structural projections may be arranged in an array intercalated with the array of the groups of mating contact portions. A receptacle connector may include an array of apertures configured to receive the structural projections. The structural projections may be shaped and positioned to reduce damage to the mating contact portions of the header connector, enable reliable manufacture, and to provide a high-density mating interface.
    Type: Application
    Filed: December 9, 2022
    Publication date: June 15, 2023
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier,, JR., John Robert Dunham, Mark W. Gailus, John Pitten, David Levine, Vysakh Sivarajan
  • Publication number: 20220173534
    Abstract: A modular high speed, high density electrical connector configurable for use in multiple configurations, including a direct attach orthogonal configuration. The connector is assembled with modules that include shielded pairs of signal conductors with mating ends that are rotated approximately 45 degrees with respect to intermediate portions of the signal conductors. The connector may have a mating interface with receptacles in one connector and pins in the mating connector. The pins may be small diameter and may be implemented with superelastic wires so as to resist damage despite having very small effective diameter. A compact mating interface resulting from small diameter mating contact portions may enable other portions of the connector, including the shielding surrounding the signal conductors to be smaller, which may raise the resonant frequency of the connector and extend its bandwidth.
    Type: Application
    Filed: February 17, 2022
    Publication date: June 2, 2022
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, John Pitten
  • Patent number: 11289830
    Abstract: A modular high speed, high density electrical connector configurable for use in multiple configurations, including a direct attach orthogonal configuration. The connector is assembled with modules that include shielded pairs of signal conductors with mating ends that are rotated approximately 45 degrees with respect to intermediate portions of the signal conductors. The connector may have a mating interface with receptacles in one connector and pins in the mating connector. The pins may be small diameter and may be implemented with superelastic wires so as to resist damage despite having very small effective diameter. A compact mating interface resulting from small diameter mating contact portions may enable other portions of the connector, including the shielding surrounding the signal conductors to be smaller, which may raise the resonant frequency of the connector and extend its bandwidth.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: March 29, 2022
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, John Pitten
  • Publication number: 20200373689
    Abstract: A modular high speed, high density electrical connector configurable for use in multiple configurations, including a direct attach orthogonal configuration. The connector is assembled with modules that include shielded pairs of signal conductors with mating ends that are rotated approximately 45 degrees with respect to intermediate portions of the signal conductors. The connector may have a mating interface with receptacles in one connector and pins in the mating connector. The pins may be small diameter and may be implemented with superelastic wires so as to resist damage despite having very small effective diameter. A compact mating interface resulting from small diameter mating contact portions may enable other portions of the connector, including the shielding surrounding the signal conductors to be smaller, which may raise the resonant frequency of the connector and extend its bandwidth.
    Type: Application
    Filed: May 19, 2020
    Publication date: November 26, 2020
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, John Robert Dunham, Mark W. Gailus, John Pitten
  • Patent number: D892058
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: August 4, 2020
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
  • Patent number: D908633
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: January 26, 2021
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
  • Patent number: D948454
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: April 12, 2022
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
  • Patent number: D953275
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: May 31, 2022
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
  • Patent number: D1002551
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: October 24, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
  • Patent number: D1002552
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: October 24, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten