Abstract: Process and composition for treating aqueous media to remove impurities using chitosan, polysilicic acid and/or poly aluminosilicate, ferric compound and clay.

Abstract: A process for the removal of soluble polyvalent metal impurities from aqueous streams, the polyvalent metal selected from groups IIIA, IIIB, IVA, IVB, VA, VB, VIB, VIIB, and VIII in the periodic table of elements, is disclosed. The process comprises, in order:(1) dissolving (a) chitosan or a water soluble salt thereof and (b) a halogenating agent capable of converting chitosan to an N-halochitosan in an aqueous stream that (i) contains said polyvalent metal impurity as a cationic or complex anionic moiety and (ii) is at a pH of 2 to 5.5, wherein an effective amount of N-halochitosan is formed in said aqueous stream to remove said polyvalent metal impurity;(2) raising the pH of the aqueous stream to a pH greater than 6, the pH being sufficiently high to form an insoluble product containing the polyvalent metal impurity and said N-halochitosan; and(3) separating the insoluble product from the aqueous stream.

Abstract: An electrochemiluminescent layer for use in apparatus for determining the concentration levels of pollutants in water by measuring the increase in light emission of a luminescent surface electrochemically excited by a supporting electrode surface, where a tris bipyridyl ruthenium complex forms a homogeneous mixture with a perfluorinated, sulfonated polymer film, deposited on a transparent, electrically conductive surface, in which case the surface may also have a fine-grained structure.

Abstract: A polymeric gelled electrolyte and the method for preparing the novel polymeric elelctrolyte in a crosslinked and noncrosslinked state is disclosed. The polymeric electrolyte is prepared from chitosan which may be crosslinked with aldehydes or remain uncrosslinked and form a superior electrolyte upon gelling in alkaline liquid.

Abstract: A clamp for securing a pole top luminaire to the top of a support post. A fitter clamp is disposed inside of the support post, while the housing of the luminaire includes a base portion which extends from the luminaire downward surrounding the outer circumference of the support post. Threaded fasteners extend through the housing base portion to engage the fitter clamp, causing the clamp to expand and compressively engage the support post between the fitter clamp and the luminaire housing base portion.

Abstract: The present invention provides a luminaire fixture having a generally cup shaped upper housing casting. A bowl shaped reflector is mounted thereto. The lower rim of the upper housing includes a flange extending outwardly and downwardly therefrom. The upper surface of the reflector includes a plurality of vent openings near its upper edge. The reflector is fitted to the lower edge of the housing such that the upper housing flange covers the vent openings in the reflector to prohibit rain and snow from entering the reflector. Further, the upper housing includes a rim extension contacting the upper surface of the reflector to seal the upper housing ballast compartment for safety requirements.

Abstract: A hinge assembly is provided for a lighting fixture whereby a bezel door is hinged to the fixture housing in a manner that it can be swung open from the open face of the housing but cannot be dropped or lose supported contact with the housing. The hinge assembly is located along one edge of the housing. The hinge assembly comprises a hinge hook portion typically an extension of the lower bezel door edge. The hinge hook is an open-faced, open-ended cylindrical structure having a centerpiece with a stud extending therefrom. The hinge bar comprises two axially aligned cylindrical sections extending typically from the lower edge of the housing. The hinge hook is fitted over the hinge bar sections and a fastener is placed over the hinge hook stud.

Abstract: Apparatus for mounting a printed circuit board to a conductive surface in a manner to allow removal of the board from the surface without requiring the use of any tools. The mounting is performed by an insulating layer covering the printed circuit board interposed between the board and the conductive surface. The insulation exhibits high temperature stability. Preferably the mounting uses hook and pile strips of nylon with one strip adhered to and covering the entire board and one or more mating strips adhered to the conductive surface.