Patents by Inventor John R. Fahey

John R. Fahey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded plastic package with heat sink and enhanced electrical performance
    Patent number: 6326678
    Abstract: A molded plastic package for semiconductor devices incorporating a heat sink, controlled impedance leads and separate power and ground rings is described. The lead frame of the package, separated by a dielectric layer, is attached to a metal heat sink. It has more than one ring for power and ground connections. The die itself is attached directly onto the heat sink through a window on the dielectric and provides high power dissipation. The package is molded using conventional materials and equipment.
    Type: Grant
    Filed: September 3, 1993
    Date of Patent: December 4, 2001
    Assignee: Asat, Limited
    Inventors: Marcos Karnezos, S. C. Chang, Edward G. Combs, John R. Fahey
  • Molded plastic package with heat sink and enhanced electrical performance
    Publication number: 20010000924
    Abstract: A molded plastic package for semiconductor devices incorporating a heat sink, controlled impedance leads and separate power and ground rings is described. The lead frame of the package, separated by a dielectric layer, is attached to a metal heat sink. It has more than one ring for power and ground connections. The die itself is attached directly onto the heat sink through a window on the dielectric and provides high power dissipation. The package is molded using conventional materials and equipment.
    Type: Application
    Filed: December 14, 2000
    Publication date: May 10, 2001
    Inventors: Marcos Karnezos, S. C. Chang, Edward G. Combs, John R. Fahey