Abstract: Additive manufacturing methods use a surrogate slurry to iteratively develop an additive manufacturing protocol and then substitutes a final slurry composition to then additively manufacture a final component using the developed additive manufacturing protocol. In the nuclear reactor component context, the final slurry composition is a nuclear fuel slurry having a composition: 30-45 vol. % monomer resin, 30-70 vol. % plurality of particles of uranium-containing material, >0-7 vol. % dispersant, photoactivated dye, photoabsorber, photoinitiator, and 0-18 vol. % (as a balance) diluent. The surrogate slurry has a similar composition, but a plurality of surrogate particles selected to represent a uranium-containing material are substituted for the particles of uranium-containing material. The method provides a means for in-situ monitoring of characteristics of the final component during manufacture as well as in-situ volumetric inspection.

Abstract: A vaporizer device includes various modular components. The vaporizer device includes a first subassembly. The first subassembly includes a cartridge connector that secures a vaporizer cartridge to the vaporizer device and includes at least two receptacle contacts that electrically communicate with the vaporizer cartridge. The vaporizer device includes a second subassembly. The second subassembly includes a skeleton defining a rigid tray that retains at least a power source. The vaporizer device also includes a third subassembly. The third subassembly includes a plurality of charging contacts that supply power to the power source, and an end cap that encloses an end of the vaporizer device.

Abstract: The viscosity of copolymers of a) ethylene and C.sub.1 -C.sub.8 acrylate or methacrylates or b) ethylene, vinyl esters of C.sub.1 -C.sub.4 carboxylic acids, and another comonomer selected from the group consisting of carbon monoxide, acrylic acid, methacrylic acid, or a glycidyl ester of acrylic or methacrylic acid is increased, while maintaining gel content at a level of less than 3%, by treatment with a free radical generating agent.

Abstract: A multilayer structure comprising a layer of film susceptible to melting when used in conjuction with a microwave susceptor, a layer of microwave susceptor material, and a layer formed from a crosslinked melt extrudable material does not melt when used in a microwave oven.

Abstract: A multilayer structure comprising a layer of film susceptible to melting when used in conjunction with a microwave susceptor, a layer of microwave susceptor material, and a layer formed from a crosslinked melt extrudable material does not melt when used in a microwave oven.

Abstract: The present invention provides a package suitable for microwave cooking and browning of food items, comprising a microwave susceptive mold containing at least one cavity for containing food items, and a microwave susceptive cover extending over and closing the cavities.

Abstract: A package for microwaving heating or cooking a food item such as an egg roll, which requires surface browning or crispening, comprises a vented tray, a drapable, liquid permeable, microwave susceptive composite material, draped over the food item, and a film lid covering the tray and conformed to the shape of the food item.

Abstract: A package with a preferentially releasable seal is provided, suitable for use in microwaveable food cooking. The seal includes a heat-releasable polymer in contact with a microwave susceptor material. Upon heating in a microwave oven, the seal releases in response to force generated by the cooking of the food.

Abstract: New composite materials useful for wrapping food items to be cooked by microwave energy comprise drapable, liquid permeable, woven or non-woven, fibrous dielectric substrates, which substrates, or fibers of which substrates, are coated and/or imbibed with one or more susceptor materials. The composite materials, when wrapped around a food item to be cooked by microwave energy, enhance the browning and/or crispening of the items.

Abstract: A controlled amount of flux is applied to a circuit board (10) by first directing liquid flux through a nozzle (54) containing means for disintegrating the flux into a very fine fog of tiny flux droplets (62). The fog of flux droplets is injected into a laminar gas stream (52), thereby creating a laminar flux stream which is directed at the circuit board to coat the board with flux. As the flux spray is being directed at the circuit board, the concentration of flux solids on the board is being regulated, typically by controlling the rate of flux pumped into the nozzle.

Abstract: A controlled amount of flux is applied to a circuit board (10) by first directing liquid flux through a nozzle (54) containing means for disintegrating the flux into a very fine fog of tiny flux droplets (62). The fog of flux droplets is injected into a laminar gas stream (52), thereby creating a laminar flux stream which is directed at the circuit board to coat the board with flux. As the flux spray is being directed at the circuit board, the concentration of flux solids on the board is being regulated, typically by controlling the rate of flux pumped into the nozzle.

Abstract: A controlled amount of a solder is applied to the tip (18) of each lead (14) of a multi-lead component (10) by first placing a solder sphere (30) in each of a plurality of cavities (24) arranged in a baseplate (22) in the same pattern as the tips of the leads. Thereafter, the tips of the leads of the component are placed in contact with the solder spheres while, at the same time, at least a pair of leads are each engaged by a separate one of a pair of alignment pins (32) rising upwardly from the baseplate. The alignment pins serve to constrain the lateral movement of the component, thereby maintaining the leads thereof in alignment with the solder spheres when the solder spheres are reflowed to bond to the tips of the leads.

Abstract: Chip carriers (10--10) are released from an end of a dispensing means (38) drawn across a holder (22) having a plurality of apertures (28--28) therein, to place a carrier in each aperture. Small solder spheres (58--58) are located in a plurality of dimples (56--56) of a planar plate (40) in arrays that are substantially the same as a plurality of bonding pad arrays (18--18) on the bottom surface of a plurality of chip carriers. A vacuum is applied to the holder (22) to hold the chip carriers (10--10) in the apertures (28--28) as the holder rotates to place the bonding pads (18--18) in contact with the solder spheres (68--68). The solder spheres (58--58) are reflowed by applying heat to form a solder "bump" (68) on each pad (18). The chip carriers (10--10) are then cooled and loaded into a plurality of the tubular members (39--39).

Abstract: The attachment of leadless chip carriers to printed wiring boards by means of soldering techniques must provide for a spacing between the chip carrier and the board. Such spacing is required for cleaning the area under the chip carrier, protecting the underlying circuitry, and accounting for stresses which may develop due to thermal mismatch between the chip carrier and the board, and to board flexure. Herein disclosed is a lead (15) for semiconductor chip carriers comprising an elongated body of high melting point electrically conductive material, e.g., solder material. Also disclosed is a method for casting such a solder lead, and a method for attaching a plurality of cast solder leads (38) to a leadless chip carrier (20).