Abstract: A method of forming a connection receptacle over a substrate includes printing a first dielectric layer over the substrate between first and second transmission lines, the first dielectric layer having a tapered cross-section along a plane extending from the first transmission line to the second transmission line; disposing a conductive layer over the printed first dielectric layer; and electrically connecting the conductive layer to a conductor of the first transmission line and a conductor of the second transmission line.

Abstract: A method of forming a connection receptacle over a substrate includes printing a first dielectric layer over the substrate between first and second transmission lines, the first dielectric layer having a tapered cross-section along a plane extending from the first transmission line to the second transmission line; disposing a conductive layer over the printed first dielectric layer; and electrically connecting the conductive layer to a conductor of the first transmission line and a conductor of the second transmission line.

Abstract: A switch includes a switching element, a substrate, a lid and a thickfilm dielectric. The substrate has a plurality of signal conductors formed thereon, at least some of which are in contact with the switching element. The lid covers the switching element and has a perimeter that intersects at least some of the signal conductors. The thickfilm dielectric is printed on the substrate below the perimeter of the lid, and the lid is mounted on the thickfilm dielectric.

Abstract: Resonance within an attenuator relay caused by stray coupling capacitances to, and stray reactance within the switched conductor that replaces the attenuator section, is mitigated by reducing the stray coupling capacitances to as low a value as possible, and by using a conductor that is a section of controlled impedance transmission line that matches the system into which the attenuator relay has been placed. A substrate having SPDT LIMMS switches on either side of a switched transmission line segment and its associated attenuator, all of which are fabricated on the substrate, will have significantly lower stray coupling capacitance across the open parts of the switches when the attenuator segment is in use. This will increase the frequency for the onset of the resonance driven by the RF voltage drop across the attenuator. A reduction in the amplitude of the resonance can be obtained by including on the substrate an additional pair of LIMMS damping switches at each end of the transmission line segment.

Abstract: Resonance within an attenuator relay caused by stray coupling capacitances to, and stray reactance within the switched conductor that replaces the attenuator section, is mitigated by reducing the stray coupling capacitances to as low a value as possible, and by using a conductor that is a section of controlled impedance transmission line that matches the system into which the attenuator relay has been placed. A substrate having SPDT LIMMS switches on either side of a switched transmission line segment and its associated attenuator, all of which are fabricated on the substrate, will have significantly lower stray coupling capacitance across the open parts of the switches when the attenuator segment is in use. This will increase the frequency for the onset of the resonance driven by the RF voltage drop across the attenuator. A reduction in the amplitude of the resonance can be obtained by including on the substrate an additional pair of LIMMS damping switches at each end of the transmission line segment.