Abstract: Flexible electronic devices may be provided. A flexible electronic device may include a flexible display, a flexible housing and one or more flexible internal components configured to allow the flexible electronic device to be deformed. Flexible displays may include flexible display layers, flexible touch-sensitive layers, and flexible display cover layers. The flexible housing may be a multi-stable flexible housing having one or more stable positions. The flexible housing may include a configurable support structure that, when engaged, provides a rigid support structure for the flexible housing. The flexible internal components may include flexible batteries, flexible printed circuits or other flexible components. A flexible battery may include flexible and rigid portions or may include a lubricious separator layer that provides flexibility for the flexible battery.

Abstract: Devices, methods and graphical user interfaces for manipulating user interfaces based on fingerprint sensor inputs are provided. While a display of an electronic device with a fingerprint sensor displays a first user interface, the device may detect movement of a fingerprint on the fingerprint sensor. In accordance with a determination that the movement of the fingerprint is in a first direction, the device allows navigating through the first user interface, and in accordance with a determination that the movement of the fingerprint is in a second direction different from the first direction, the device allows displaying a second user interface different from the first user interface on the display.

Abstract: Systems, methods, and software for filtering components, such as hardware components, compatible with computer-modeled structures are presented. A compatible components system provides selection methods that present components compatible with computer-aided design (CAD) models designed in computer modeling software. The system executes methods designed to filter components made available to designers using attribute information of the features and attribute information of the components. Designers may interact with the compatibility methods numerous times, narrowing components through a series or number of filtering steps until a desired compatible component is easily selected. The computer modeling software may include graphical user interfaces for selecting component source locations, filtering types of components presented by the system, and adding components to CAD models.

Abstract: Systems, methods, and software for filtering components, such as hardware components, compatible with computer-modeled structures are presented. A compatible components system provides selection methods that present components compatible with computer-aided design (CAD) models designed in computer modeling software. The system executes methods designed to filter components made available to designers using attribute information of the features and attribute information of the components. Designers may interact with the compatibility methods numerous times, narrowing components through a series or number of filtering steps until a desired compatible component is easily selected. The computer modeling software may include graphical user interfaces for selecting component source locations, filtering types of components presented by the system, and adding components to CAD models.

Abstract: A temporal correlation may be determined between times specified according to different time standards on different storage network components. A host system may poll a storage system periodically. In response to each poll request, the storage system may respond with the current time on the storage system (CST) according to the time standard of the storage system. The host system may store temporal correlation information (TCI) associating the CST and the current time on the host system (CHT) according to the time standard of the host system. A data structure (TCT) may be provided, where each entry may specify TCI for a CST/CHT pair, the TCI including the CST, CHT and other information corresponding to the temporal correlation between the pair. The TCI may be used to correlate the time of a phenomenon according to the host system time standard to a time according to the storage system time standard.

Abstract: A temporal correlation may be determined between times specified according to different time standards on different storage network components. A host system may poll a storage system periodically. In response to each poll request, the storage system may respond with the current time on the storage system (CST) according to the time standard of the storage system. The host system may store temporal correlation information (TCI) associating the CST and the current time on the host system (CHT) according to the time standard of the host system. A data structure (TCT) may be provided, where each entry may specify TCI for a CST/CHT pair, the TCI including the CST, CHT and other information corresponding to the temporal correlation between the pair. The TCI may be used to correlate the time of a phenomenon according to the host system time standard to a time according to the storage system time standard.

Abstract: Techniques for processing I/O operations in a data storage system may include: receiving I/O operations directed to a logical device associated with a service level specifying a target I/O response time goal; receiving a input identifying whether to calculate an observed I/O response time for the logical device using only an internal processing time associated with processing performed within the data storage system when servicing I/O operations directed to the logical device; determining, in accordance with the input and the I/O operations directed to the logical device, the observed I/O response time for the logical device; determining a service level violation for the first logical device whereby the observed I/O response time violates the service level; and responsive to determining the service level violation whereby the observed I/O response time violates the service level, performing processing to alleviate or remove the first service level violation.

Abstract: Techniques for processing I/O operations in a data storage system may include: receiving I/O operations directed to a logical device associated with a service level specifying a target I/O response time goal; receiving a input identifying whether to calculate an observed I/O response time for the logical device using only an internal processing time associated with processing performed within the data storage system when servicing I/O operations directed to the logical device; determining, in accordance with the input and the I/O operations directed to the logical device, the observed I/O response time for the logical device; determining a service level violation for the first logical device whereby the observed I/O response time violates the service level; and responsive to determining the service level violation whereby the observed I/O response time violates the service level, performing processing to alleviate or remove the first service level violation.

Abstract: A martial arts striking device using a pair of spaced and heavy duty spring assemblies with a top bracket having a centered opening for receiving an upright post supporting a resilient striking bag. The lower ends of the spring assemblies are secured to a bottom bracket, which is fastened to a firm footing such as a floor. The wire making up the springs are of such a diameter that the springs have a low spring constant, meaning the springs are highly resistive to impacts against the bag and will return to an upright position without undue oscillation.

Abstract: A method for packaging a semiconductor device (22) formed on a die (12) having opposing major surfaces includes pre-soldering the die (12) at wafer level using an electroplating process, wherein the die (12) has solder bumps disposed on each opposing major surface. The pre-soldered wafer (10) is then diced into pre-soldered dies. The die (12) is placed in a glass sleeve (45) and aligned with two bumpless lead assemblies (46, 48). The bumpless lead assemblies (46, 48) are solder bonded to the die (12) via a reflow process. The reflow process also partially melts the glass sleeve (45), thereby forming a hermetically sealed glass capsule (55) surrounding the semiconductor device (22).

Abstract: A semiconductor device package having a substrate, one or more semiconductor devices mounted on the top surface of the substrate, a heat sink having a surface in opposed spaced parallel relation to the top surface of the substrate, and at least one deformable heat transfer member positioned between a device mounted on the top surface of the substrate, and the surface of the heat sink. The heat transfer member is comprised of a porous block of material, and a heat conductive non-volatile liquid retained within the block of material by a surface tension. The heat transfer member being operative to transfer heat from the device to the heat sink.