Abstract: Disclosed is an apparatus wherein an electric circuit with at least a power source, two electrodes and a plating solution is established. The plating solution comprises a solvent and, dissolved in the solvent, at least a first metal and a second metal. The power source supplies a current to the electric circuit during a plating process. The amount of electric current is above that required to achieve the overpotential for plating the first metal, but below that required to achieve the overpotential for plating the second metal such that only the first metal plates. This apparatus can be implemented, for example, in conjunction with a plating apparatus or an analysis and dosing apparatus of an electrodeposition system. In the case of an analysis and dosing apparatus, additional components further allow for the addition of that specific metal back into the plating solution. Also disclosed herein are associated methods.

Abstract: Disclosed is an apparatus wherein an electric circuit with at least a power source, two electrodes and a plating solution is established. The plating solution comprises a solvent and, dissolved in the solvent, at least a first metal and a second metal. The power source supplies a current to the electric circuit during a plating process. The amount of electric current is above that required to achieve the overpotential for plating the first metal, but below that required to achieve the overpotential for plating the second metal such that only the first metal plates. This apparatus can be implemented, for example, in conjunction with a plating apparatus or an analysis and dosing apparatus of an electrodeposition system. In the case of an analysis and dosing apparatus, additional components further allow for the addition of that specific metal back into the plating solution. Also disclosed herein are associated methods.

Abstract: A process for producing a terminal metal pad structure electrically interconnecting a package and other components. More particularly, the invention encompasses a process for producing a plurality of corrosion-resistant terminal metal pads. Each pad includes a base pad containing copper which is encapsulated within a series of successively electroplated metal encapsulating films to produce a corrosion-resistant terminal metal pad.

Abstract: A multiple plane pair thin-film structure and a process for the manufacture of that structure. The multiple plane pair thin-film structure is of modular design and manufacture, such that each module comprising the structure is manufactured and tested individually before assembly. The thin film wiring structure is comprised of a plurality of true plane pair thin-film structures. Each such plane pair thin-film structure is manufactured as a module, the functionality of which can be tested for conformity to applicable specifications. Each module is designed and fabricated as a plane pair thin-film structure.

Abstract: A process for producing a terminal metal pad structure electrically interconnecting a package and other components. More particularly, the invention encompasses a process for producing a plurality of corrosion-resistant terminal metal pads. Each pad includes a base pad containing copper which is encapsulated within a series of successively electroplated metal encapsulating films to produce a corrosion-resistant terminal metal pad.

Abstract: A process for partially repairing defective Multi-Chip Module (MCM) Thin-Film (TF) wiring nets. The process comprises the steps of locating a short circuit between any two nets of the MCM, identifying a site to cut in one of the two nets, and deleting an internal portion of one of the two nets at the identified site.

Abstract: A test pad is formed outside an array of pads included in connection structures such as pin mounting pads to which connection pins may be brazed in, for example, bottom side metallurgy of a multi-layer modular electronic package. In-line voltage plane testing may then be accomplished through temporary connections to the test pads for any desired layer, such as top side metallurgy distribution layers, while protecting the pin-mounting pads from physical and/or chemical damage or contamination during manufacturing processes for addition of layers to the electrical interconnection structure of the multi-layer module.

Abstract: A process for partially repairing defective Multi-Chip Module (MCM) Thin-Film (TF) wiring nets. The process comprises the steps of locating a short circuit between any two nets of the MCM, identifying a site to cut in one of the two nets, and deleting an internal portion of one of the two nets at the identified site.

Abstract: A Process for graphically assisting the partial repair of defective MCM TF wiring nets. The process comprises the steps of inserting the wiring layer of the thin-film device in a tester, scanning the wiring layer of the thin-film device with the tester, identifying defects in the wiring nets, prioritizing the defects based on a function of each of the defective wiring nets, and repairing the defects based on priority.