Abstract: An apparatus includes an injection molding machine, a hot runner apparatus attached to the molding machine, and a mold defining a part cavity. The mold is attached to the molding machine and operably engages the hot runner apparatus. The hot runner apparatus has secondary nozzles that engage respective sprue assemblies on the mold for communicating melted plastic material to the mold cavity. Each sprue assembly includes a movably mounted sprue and a stress-reducing mechanism with spring washers that support the sprue to provide sufficient force to eliminate leaking at abutting contact surfaces against the secondary nozzles, but that allow limited movement of the sprue to reduce excessive stress focused on the respective sprues. Since the stress-reducing mechanism is located in the mold, each stress-reducing mechanism can be tailored to the particular needs of that particular mold and the particular melted material being processed.