Abstract: An angularly adjustable mounting device is disclosed for use with a small electronic device such as a wireless camera. Also disclosed is a method of using the mounting device. The mounting device has an attachment device extending from a rotatable bearing. The bearing is angularly rotatable with a socket formed by an expandable bearing holder that may include spaced apart arms extending outwardly from a mounting plate. Rotation of an outer housing around the arms engages an inclined ramp thereby deflecting the arms inwardly and into frictional contact bearing to inhibit movement of the camera relative to a base. The outer housing is configured to rotate in an opposing direction to allow the electronic device to be repositioned.

Abstract: An angularly adjustable mounting device is disclosed for use with a small electronic device such as a wireless camera. Also disclosed is a method of using the mounting device. The mounting device has an attachment device extending from a rotatable bearing. The bearing is angularly rotatable with a socket formed by an expandable bearing holder that may include spaced apart arms extending outwardly from a mounting plate. Rotation of an outer housing around the arms engages an inclined ramp thereby deflecting the arms inwardly and into frictional contact bearing to inhibit movement of the camera relative to a base. The outer housing is configured to rotate in an opposing direction to allow the electronic device to be repositioned.

Abstract: A heat sink and an EMI shield are integrated via injection molding. The heat sink and the EMI shield may be molded together as an integrated unit with an intervening non-electrically conductive layer formed between the heat sink and the EMI shield during the injection molding process. The integrated molded unit could also be molded to a thermally conductive layer comprising another material such as an elastomer suitable for more precisely conforming to the contours of an electrical component for maximizing thermal transfer. Accordingly, the number of steps and amount of materials required to provide thermal dissipation and EMI protection for an electrical component may be reduced.

Abstract: A heat sink assembly uses a pin and a spring arrangement to bias a heat sink against an underlying support with an electrical component in between. A lock cap, mounted on a head of the pin, selectively engages a retainer formed beneath an upper end of a heat dissipating element or fin of the heat sink to precompress the spring. When the lock cap is engaged and the spring is precompressed, the pin may be attached to the underlying support without opposing the force of the spring. When the attachment is complete and the lock cap is disengaged, the spring is allowed to act against the head of the pin and the base of the heat sink to operatively bias the heat sink against the underlying support.

Abstract: A heat sink and an EMI shield are integrated via injection molding. The heat sink and the EMI shield may be molded together as an integrated unit with an intervening non-electrically conductive layer formed between the heat sink and the EMI shield during the injection molding process. The integrated molded unit could also be molded to a thermally conductive layer comprising another material such as an elastomer suitable for more precisely conforming to the contours of an electrical component for maximizing thermal transfer. Accordingly, the number of steps and amount of materials required to provide thermal dissipation and EMI protection for an electrical component may be reduced.

Abstract: A heat sink assembly uses a pin and a spring arrangement to bias a heat sink against an underlying support with an electrical component in between. A lock cap, mounted on a head of the pin, selectively engages a retainer formed beneath an upper end of a heat dissipating element or fin of the heat sink to precompress the spring. When the lock cap is engaged and the spring is precompressed, the pin may be attached to the underlying support without opposing the force of the spring. When the attachment is complete and the lock cap is disengaged, the spring is allowed to act against the head of the pin and the base of the heat sink to operatively bias the heat sink against the underlying support.