Patents by Inventor John Reed Hannig

John Reed Hannig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rack Assembly for Vertical Airflow Cooled Devices
    Publication number: 20230255000
    Abstract: An assembly includes a lower sub-assembly containing a first fan, a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, and a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths.
    Type: Application
    Filed: April 14, 2023
    Publication date: August 10, 2023
    Inventors: Peter Alfred Devick Peterson, Nilofer Rajpurkar, John Reed Hannig, Patrick Gerard Brogan, Scott Allen Densmore, Kenneth S. Hayd
  • Rack assembly for vertical airflow cooled devices
    Patent number: 11659692
    Abstract: An assembly includes a lower sub-assembly containing a first fan, a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, and a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: May 23, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Peter Alfred Devick Peterson, Nilofer Rajpurkar, John Reed Hannig, Patrick Gerard Brogan, Scott Allen Densmore, Kenneth S. Hayd
  • Rack Assembly for Vertical Airflow Cooled Devices
    Publication number: 20210195802
    Abstract: An assembly includes a lower sub-assembly containing a first fan, a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, and a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths.
    Type: Application
    Filed: December 20, 2019
    Publication date: June 24, 2021
    Inventors: Peter Alfred Devick Peterson, Nilofer Rajpurkar, John Reed Hannig, Patrick Gerard Brogan, Scott Allen Densmore, Kenneth S. Hayd
  • Densely packed telecommunications equipment enclosure
    Patent number: 5781410
    Abstract: A telecommunications equipment enclosure, designed to be placed outdoors at a remote location, houses equipment to provide a large number of voice channels, an AC power supply, an AC/DC distribution panel, protector panels, a back-up battery plant, multiplexers, a fiber distribution panel, and a separate cable splice area. Other equipment may also be housed in the enclosure if needed. The enclosure is configurable to customers' requirements, and is extremely small and densely packed relative to its channel capacity.
    Type: Grant
    Filed: January 17, 1996
    Date of Patent: July 14, 1998
    Assignee: NEC America, Inc.
    Inventors: Mark Sherman Keown, Casey Martin Bardue, John Reed Hannig, William R. Olsen