Patents by Inventor John Robert Siomkos
John Robert Siomkos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220028838Abstract: The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electronic components are encapsulated by a mold compound. In an exemplary aspect, a portion of the mold compound on the bottom side of the module substrate is removed, exposing a semiconductor die surface of at least one of the electronic components.Type: ApplicationFiled: October 11, 2021Publication date: January 27, 2022Inventors: John Robert Siomkos, Edward T. Spears, Mark Crandall
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Publication number: 20200075547Abstract: The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electronic components are encapsulated by a mold compound. In an exemplary aspect, a portion of the mold compound on the bottom side of the module substrate is removed, exposing a semiconductor die surface of at least one of the electronic components.Type: ApplicationFiled: August 31, 2018Publication date: March 5, 2020Inventors: John Robert Siomkos, Edward T. Spears, Mark Crandall
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Patent number: 9799444Abstract: This disclosure relates generally to directional couplers. In one embodiment, a directional coupler includes a first port, a second port, a third port, a first inductive element, a second inductive element, a first switchable path, and a second switchable path. The first inductive element is coupled between the first port and the second port, while the second inductive element is mutually coupled to the first inductive element. The first switchable path is configured to be opened and closed, wherein the first switchable path is coupled between a first location of the second inductive element and the third port. The second switchable path is configured to be opened and closed, wherein the second switchable path is coupled between a second location of the second inductive element and the third port. In this manner, a directivity of the directional coupler can be switched between a forward direction and a reverse direction.Type: GrantFiled: August 31, 2015Date of Patent: October 24, 2017Assignee: Qorvo US, Inc.Inventors: Marcus Granger-Jones, John Robert Siomkos, Jeppe Korshøj Bendixen, John Avery Capwell, Jayanti Jaganatha Rao
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Patent number: 9349938Abstract: Acoustic wave devices and methods of coating a protective film of alumina (Al2O3) on the acoustic wave devices are disclosed herein. The protective film is applied through an atomic layer deposition (ALD) process. The ALD process can deposit very thin layers of alumina on the surface of the acoustic wave devices in a precisely controlled manner. Thus, the uniform film does not significantly distort the operation of the acoustic wave device.Type: GrantFiled: April 16, 2013Date of Patent: May 24, 2016Assignee: RF Micro Devices, Inc.Inventors: Merrill Albert Hatcher, Jr., Jayanti Jaganatha Rao, John Robert Siomkos
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Patent number: 9325353Abstract: An architecture for a radio frequency (RF) front-end is disclosed. The architecture for the RF front-end includes a circuit module that includes a plurality of dies partitioned on the circuit module. A plurality of filter banks with individual ones of the plurality of filter banks disposed on each of the plurality of circuit dies is also included. Further included is a plurality of switches having individual ones of the plurality of switches coupled to corresponding ones of the plurality of filter banks and in at least one embodiment a control system is configured to open and close selected ones of the plurality of switches.Type: GrantFiled: September 12, 2012Date of Patent: April 26, 2016Assignee: RF Micro Devices, Inc.Inventors: John Robert Siomkos, Jayanti Jaganatha Rao, Christopher Truong Ngo
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Publication number: 20160065167Abstract: This disclosure relates generally to directional couplers. In one embodiment, a directional coupler includes a first port, a second port, a third port, a first inductive element, a second inductive element, a first switchable path, and a second switchable path. The first inductive element is coupled between the first port and the second port, while the second inductive element is mutually coupled to the first inductive element. The first switchable path is configured to be opened and closed, wherein the first switchable path is coupled between a first location of the second inductive element and the third port. The second switchable path is configured to be opened and closed, wherein the second switchable path is coupled between a second location of the second inductive element and the third port. In this manner, a directivity of the directional coupler can be switched between a forward direction and a reverse direction.Type: ApplicationFiled: August 31, 2015Publication date: March 3, 2016Inventors: Marcus Granger-Jones, John Robert Siomkos, Jeppe Korshøj Bendixen, John Avery Capwell, Jayanti Jaganatha Rao
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Patent number: 9137934Abstract: Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.Type: GrantFiled: July 25, 2011Date of Patent: September 15, 2015Assignee: RF Micro Devices, Inc.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Brian D. Sawyer, Milind Shah, John Robert Siomkos, Mark Alan Crandall, Dan Carey
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Patent number: 9082953Abstract: Acoustic wave devices and methods of coating a protective film of alumina (Al2O3) on the acoustic wave devices are disclosed herein. The protective film is applied through an atomic layer deposition (ALD) process. The ALD process can deposit very thin layers of alumina on the surface of the acoustic wave devices in a precisely controlled manner. Thus, the uniform film does not significantly distort the operation of the acoustic wave device.Type: GrantFiled: April 16, 2013Date of Patent: July 14, 2015Assignee: RF Micro Devices, Inc.Inventors: Merrill Albert Hatcher, Jr., Jayanti Jaganatha Rao, John Robert Siomkos
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Publication number: 20130230643Abstract: Acoustic wave devices and methods of coating a protective film of alumina (Al2O3) on the acoustic wave devices are disclosed herein. The protective film is applied through an atomic layer deposition (ALD) process. The ALD process can deposit very thin layers of alumina on the surface of the acoustic wave devices in a precisely controlled manner. Thus, the uniform film does not significantly distort the operation of the acoustic wave device.Type: ApplicationFiled: April 16, 2013Publication date: September 5, 2013Applicant: RF Micro Devices, Inc.Inventors: Merrill Albert Hatcher, JR., Jayanti Jaganatha Rao, John Robert Siomkos
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Patent number: 8440012Abstract: Acoustic wave devices and methods of coating a protective film of alumina (Al2O3) on the acoustic wave devices are disclosed herein. The protective film is applied through an atomic layer deposition (ALD) process. The ALD process can deposit very thin layers of alumina on the surface of the acoustic wave devices in a precisely controlled manner. Thus, the uniform film does not significantly distort the operation of the acoustic wave device.Type: GrantFiled: September 14, 2011Date of Patent: May 14, 2013Assignee: RF Micro Devices, Inc.Inventors: Merrill Albert Hatcher, Jr., Jayanti Jaganatha Rao, John Robert Siomkos
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Publication number: 20130072253Abstract: An architecture for a radio frequency (RF) front-end is disclosed. The architecture for the RF front-end includes a circuit module that includes a plurality of dies partitioned on the circuit module. A plurality of filter banks with individual ones of the plurality of filter banks disposed on each of the plurality of circuit dies is also included. Further included is a plurality of switches having individual ones of the plurality of switches coupled to corresponding ones of the plurality of filter banks and in at least one embodiment a control system is configured to open and close selected ones of the plurality of switches.Type: ApplicationFiled: September 12, 2012Publication date: March 21, 2013Applicant: RF MICRO DEVICES, INC.Inventors: John Robert Siomkos, Jayanti Jaganatha Rao, Christopher Truong Ngo
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Patent number: 8351221Abstract: The present disclosure is related to an electronic assembly in a stacked configuration. Electronic components are formed on substrates at each level of the stacked configuration. Electromagnetic shield compartments may be provided which substantially encapsulate the electronic components. Conductive vias are formed within the substrates on each level of the stacked configuration and coupled to one another so that the electromagnetic shields at each level of the stack can couple to a common node.Type: GrantFiled: January 14, 2011Date of Patent: January 8, 2013Assignee: RF Micro Devices, Inc.Inventors: John Robert Siomkos, Mark Alan Crandall, Carl Hinshaw
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Patent number: 8313985Abstract: Power amplifiers and methods of coating a protective film of alumina (Al2O3) on the power amplifiers are disclosed herein. The protective film is applied through an atomic layer deposition (ALD) process. The ALD process can deposit very thin layers of alumina on the surface of the power amplifier in a precisely controlled manner. Thus, the ALD process can form a uniform film that is substantially free of free of pin-holes and voids.Type: GrantFiled: September 14, 2011Date of Patent: November 20, 2012Assignee: RF Micro Devices, Inc.Inventors: Merrill Albert Hatcher, Jr., Jayanti Jaganatha Rao, John Robert Siomkos
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Publication number: 20120182706Abstract: The present disclosure is related to an electronic assembly in a stacked configuration. Electronic components are formed on substrates at each level of the stacked configuration. Electromagnetic shield compartments may be provided which substantially encapsulate the electronic components. Conductive vias are formed within the substrates on each level of the stacked configuration and coupled to one another so that the electromagnetic shields at each level of the stack can couple to a common node.Type: ApplicationFiled: January 14, 2011Publication date: July 19, 2012Applicant: RF MICRO DEVICES, INC.Inventors: John Robert Siomkos, Mark Alan Crandall, Carl Hinshaw
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Publication number: 20120097970Abstract: Power amplifiers and methods of coating a protective film of alumina (Al2O3) on the power amplifiers are disclosed herein. The protective film is applied through an atomic layer deposition (ALD) process. The ALD process can deposit very thin layers of alumina on the surface of the power amplifier in a precisely controlled manner. Thus, the ALD process can form a uniform film that is substantially free of free of pin-holes and voids.Type: ApplicationFiled: September 14, 2011Publication date: April 26, 2012Applicant: RF MICRO DEVICES, INC.Inventors: John Robert Siomkos, Merrill Albert Hatcher, JR., Jayanti Jaganatha Rao
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Publication number: 20120091855Abstract: Acoustic wave devices and methods of coating a protective film of alumina (Al2O3) on the acoustic wave devices are disclosed herein. The protective film is applied through an atomic layer deposition (ALD) process. The ALD process can deposit very thin layers of alumina on the surface of the acoustic wave devices in a precisely controlled manner. Thus, the uniform film does not significantly distort the operation of the acoustic wave device.Type: ApplicationFiled: September 14, 2011Publication date: April 19, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Merrill Albert Hatcher, JR., Jayanti Jaganatha Rao, John Robert Siomkos
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Publication number: 20120044653Abstract: Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.Type: ApplicationFiled: July 25, 2011Publication date: February 23, 2012Applicant: RF MICRO DEVICES, INC.Inventors: Thomas Scott Morris, Ulrik Riis Madsen, Brian D. Sawyer, Milind Shah, John Robert Siomkos, Mark Alan Crandall, Dan Carey
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Patent number: 6259902Abstract: A dual channel receiver (100) includes a front end bandpass filter (120) that has a front end bandwidth, a first mixer (130), a second mixer (135), and two essentially identical receiver back ends (190, 195). The front end bandpass filter splits a received signal into a first signal (121) and a second signal (122) of essentially equal signal strengths and provides out of band isolation between first and second signal outputs (123, 124). The first mixer is coupled to the first signal and to a high side injection signal (131), and generates a first mixer output signal (132). The second mixer is coupled to the second signal and to a low side injection signal (136), and generates a second mixer output signal (137). Each of the two essentially identical receiver back ends is coupled to one of the first and second mixer output signals.Type: GrantFiled: October 29, 1998Date of Patent: July 10, 2001Assignee: Motorola, Inc.Inventors: John Robert Siomkos, Edgar Herbert Callaway, Jr.
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Patent number: 6184751Abstract: An amplifier circuit (20) uses a series transistor (38) to couple the output of an amplifier (26) to a tuned circuit load (40) and to act as a variable resistance. In one embodiment for a multi-band receiver, multiple series transistors (38, 42) are switched for connecting different tuned circuits (40, 44) to the amplifier's output, and an activated one of the series transistors receives a gate voltage that varies its resistance so as to achieve gain control. An activated series transistors can also provide a resistance that stabilizes the amplifier (26).Type: GrantFiled: August 17, 1998Date of Patent: February 6, 2001Assignee: Motorola, Inc.Inventors: John Robert Siomkos, Edgar Herbert Callaway, Jr.