Patents by Inventor John Ryan Sporre

John Ryan Sporre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11869937
    Abstract: A semiconductor device including a fin structure including a recess, a first gate formed in the recess of the fin structure, and a second gate formed outside the fin structure.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: January 9, 2024
    Assignee: International Business Machines Corporation
    Inventors: Marc Adam Bergendahl, Gauri Karve, Fee Li Lie, Eric R. Miller, Robert Russell Robison, John Ryan Sporre, Sean Teehan
  • Patent number: 11869936
    Abstract: A semiconductor device includes a fin structure including a recess formed in an upper surface of the fin structure, an inner gate formed in the recess of the fin structure, and an outer gate formed outside and around the fin structure.
    Type: Grant
    Filed: August 14, 2021
    Date of Patent: January 9, 2024
    Assignee: International Business Machines Corporation
    Inventors: Marc Adam Bergendahl, Gauri Karve, Fee Li Lie, Eric R. Miller, Robert Russell Robison, John Ryan Sporre, Sean Teehan
  • Patent number: 11462631
    Abstract: Methods, and devices related to authentication of chips using physical unclonable function (PUF) are disclosed. The semiconductor chip includes a substrate. The semiconductor chip includes multiple devices formed on the substrate. Each device includes multiple fins. A gate is formed on the multiple fins with a gate cut (CT) design that results in random distribution of complete gate cut and incomplete gate cut for each of the multiple devices based on a natural process variation in semiconductor manufacturing for each device. A physical unclonable function (PUF) region is defined in accordance with the random distribution.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: October 4, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kangguo Cheng, Eric Miller, Fee Li Lie, Gauri Karve, Marc A. Bergendahl, John Ryan Sporre
  • Publication number: 20220140074
    Abstract: A semiconductor device including a fin structure including a recess, a first gate formed in the recess of the fin structure, and a second gate formed outside the fin structure.
    Type: Application
    Filed: January 19, 2022
    Publication date: May 5, 2022
    Inventors: Marc Adam Bergendahl, Gauri Karve, Fee Li Lie, Eric R. Miller, Robert Russell Robison, John Ryan Sporre, Sean Teehan
  • Patent number: 11239316
    Abstract: A semiconductor device includes a fin structure including a cylindrical shape, an inner gate formed inside the fin structure, and an outer gate formed outside the fin structure and connected to the inner gate.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: February 1, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Marc Adam Bergendahl, Gauri Karve, Fee Li Lie, Eric R. Miller, Robert Russell Robison, John Ryan Sporre, Sean Teehan
  • Publication number: 20210376078
    Abstract: A semiconductor device includes a fin structure including a recess formed in an upper surface of the fin structure, an inner gate formed in the recess of the fin structure, and an outer gate formed outside and around the fin structure.
    Type: Application
    Filed: August 14, 2021
    Publication date: December 2, 2021
    Inventors: Marc Adam BERGENDAHL, Gauri KARVE, Fee Li LIE, Eric R. MILLER, Robert Russell ROBISON, John Ryan SPORRE, Sean TEEHAN
  • Publication number: 20210320190
    Abstract: Methods, and devices related to authentication of chips using physical unclonable function (PUF) are disclosed. The semiconductor chip includes a substrate. The semiconductor chip includes multiple devices formed on the substrate. Each device includes multiple fins. A gate is formed on the multiple fins with a gate cut (CT) design that results in random distribution of complete gate cut and incomplete gate cut for each of the multiple devices based on a natural process variation in semiconductor manufacturing for each device. A physical unclonable function (PUF) region is defined in accordance with the random distribution.
    Type: Application
    Filed: April 14, 2020
    Publication date: October 14, 2021
    Inventors: Kangguo Cheng, Eric Miller, Fee Li Lie, Gauri Karve, Marc A. Bergendahl, John Ryan Sporre
  • Patent number: 11127815
    Abstract: A semiconductor device includes a fin structure having a circular cylindrical shape, and including a first recess formed on a first side of the fin structure and a second recess formed on a second side of the fin structure opposite the first side, an inner gate formed inside the fin structure, and an inner gate insulating layer formed between the inner gate and an inner surface of the fin structure.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: September 21, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Marc Adam Bergendahl, Gauri Karve, Fee Li Lie, Eric R. Miller, Robert Russell Robison, John Ryan Sporre, Sean Teehan
  • Publication number: 20190259832
    Abstract: A semiconductor device includes a fin structure having a circular cylindrical shape, and including a first recess formed on a first side of the fin structure and a second recess formed on a second side of the fin structure opposite the first side, an inner gate formed inside the fin structure, and an inner gate insulating layer formed between the inner gate and an inner surface of the fin structure.
    Type: Application
    Filed: April 30, 2019
    Publication date: August 22, 2019
    Inventors: Marc Adam BERGENDAHL, Gauri KARVE, Fee Li LIE, Eric R. MILLER, Robert Russell ROBISON, John Ryan SPORRE, Sean TEEHAN
  • Publication number: 20190259833
    Abstract: A semiconductor device includes a fin structure including a cylindrical shape, an inner gate formed inside the fin structure, and an outer gate formed outside the fin structure and connected to the inner gate.
    Type: Application
    Filed: April 30, 2019
    Publication date: August 22, 2019
    Inventors: Marc Adam BERGENDAHL, Gauri Karve, Fee Li Lie, Eric R. Miller, Robert Russell Robison, John Ryan Sporre, Sean Teehan
  • Patent number: 10381437
    Abstract: A semiconductor device includes a fin structure including a cylindrical shape, an inner gate formed inside the fin structure, and an outer gate formed outside the fin structure and connected to the inner gate.
    Type: Grant
    Filed: December 30, 2017
    Date of Patent: August 13, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Marc Adam Bergendahl, Gauri Karve, Fee Li Lie, Eric R. Miller, Robert Russell Robison, John Ryan Sporre, Sean Teehan
  • Publication number: 20180122947
    Abstract: A semiconductor device includes a fin structure including a cylindrical shape, an inner gate formed inside the fin structure, and an outer gate formed outside the fin structure and connected to the inner gate.
    Type: Application
    Filed: December 30, 2017
    Publication date: May 3, 2018
    Inventors: Marc Adam Bergendahl, Gauri Karve, Fee Li Lie, Eric R. Miller, Robert Russell Robison, John Ryan Sporre, Sean Teehan
  • Patent number: 9917196
    Abstract: A semiconductor device includes a fin structure comprising a cylindrical shape and including a recess formed in an upper surface of the fin structure, an inner gate formed inside the fin structure, an outer gate formed outside the fin structure, and a conductor formed in the recess and connecting the inner and outer gates.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: March 13, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Marc Adam Bergendahl, Gauri Karve, Fee Li Lie, Eric R. Miller, Robert Russell Robison, John Ryan Sporre, Sean Teehan