Abstract: A treated copper surface for bonding, using adhesive such as epoxy glass, in applications such as multilayer circuit boards. The copper surface is covered with a thin layer of chromium having a roughened (etched) outer surface. The chromium layer precludes chemical reactions which destroy the polar groups of epoxy molecules and which thereby cause delamination of copper-epoxy bonds. The etched surface greatly enhances the bond strength by providing a roughened cracked surface which provides a strong mechanical bond. Copper surfaces treated in this manner form epoxy glass bonds having tensile strengths of about 2750 psi.