Abstract: Systems and methods of deploying one or more software components to a target computer infrastructure are disclosed. A descriptor file that declares a desired state of one or more target computing devices of a target computer infrastructure is parsed. A live state of the one or more target computing devices is obtained. A set of target computing devices having the live state different from the desired state is identified. A plan script that includes deployment commands configured to deploy one or more software components to each computing device is generated. The plan script can be optimized such that when executed the software components are deployed with higher efficiency, system stability, minimum downtime, etc.

Abstract: Connecting to a network server includes determining, at a first server, to which one of N mirrored servers a request from a client should be routed based at least in part on an address indicating the client and a route to the client and on the quality of service between at least some of the N mirrored servers to the client and determining to route requests from other clients associated with the address to the one of the N mirrored servers.

Abstract: A ceramic chip carrier is disclosed which preferably includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and at least one pin which is mechanically and electrically connected to a contact pad on the circuitized surface. Each mechanical/electrical connection between a pin and a contact pad includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.