Abstract: An apparatus and method are disclosed for monitoring and/or detecting concentrations of a chemical precursor in a reaction chamber. The apparatus and method have an advantage of operating in a high temperature environment. An optical emissions spectrometer (OES) is coupled to a gas source, such as a solid source vessel, in order to monitor or detect an output of the chemical precursor to the reaction chamber. Alternatively, a small sample of precursor can be periodically monitored flowing into the OES and into a vacuum pump, thus bypassing the reaction chamber.

Abstract: A spatial atomic layer deposition apparatus (10), including a showerhead (16) with a showerhead side (18) having a center, a central area and a circumferential area. The apparatus also includes a susceptor (12) having a substrate support side that extends parallel to and of opposite the showerhead side forming a gap. The susceptor and the showerhead are rotatable relative to each other around an axis of rotation. The apparatus has a plurality of switchable showerhead sections. The apparatus also includes a plurality of multi-way valve assemblies. Each switchable showerhead section is fluidly connected with one of the plurality of multi-way valve assemblies, so as to fluidly connect a selected one of a plurality of different gas sources with that switchable showerhead section.

Abstract: A diaphragm valve is disclosed. The diaphragm valve may include, a valve body comprising a valve channel, the valve channel including an inlet channel and an outlet channel. The diaphragm valve may also include, a valve seat adjacent to the valve channel and a flexible diaphragm comprising a wetted surface and an opposing non-wetted surface, the flexible diaphragm being disposed adjacent to the valve channel. The diaphragm valve may also include, a flexible heater disposed over the non-wetted surface of the flexible diaphragm, and a valve actuator that is operable to operable to move the wetted surface of the flexible diaphragm into and out of contact with the valve seat. Valve components including a flexible heater and methods for forming such valve components are also disclosed.

Abstract: A diaphragm valve is disclosed. The diaphragm valve may include, a valve body comprising a valve channel, the valve channel including an inlet channel and an outlet channel. The diaphragm valve may also include, a valve seat adjacent to the valve channel and a flexible diaphragm comprising a wetted surface and an opposing non-wetted surface, the flexible diaphragm being disposed adjacent to the valve channel. The diaphragm valve may also include, a flexible heater disposed over the non-wetted surface of the flexible diaphragm, and a valve actuator that is operable to operable to move the wetted surface of the flexible diaphragm into and out of contact with the valve seat. Valve components including a flexible heater and methods for forming such valve components are also disclosed.

Abstract: A spatial atomic layer deposition apparatus (10), including a showerhead (16) with a showerhead side (18) having a center, a central area and a circumferential area. The apparatus also includes a susceptor (12) having a substrate support side that extends parallel to and of opposite the showerhead side forming a gap. The susceptor and the showerhead are rotatable relative to each other around an axis of rotation. The apparatus has a plurality of switchable showerhead sections. The apparatus also includes a plurality of multi-way valve assemblies. Each switchable showerhead section is fluidly connected with one of the plurality of multi-way valve assemblies, so as to fluidly connect a selected one of a plurality of different gas sources with that switchable showerhead section.

Abstract: An apparatus and method are disclosed for monitoring and/or detecting concentrations of a chemical precursor in a reaction chamber. The apparatus and method have an advantage of operating in a high temperature environment. An optical emissions spectrometer (OES) is coupled to a gas source, such as a solid source vessel, in order to monitor or detect an output of the chemical precursor to the reaction chamber. Alternatively, a small sample of precursor can be periodically monitored flowing into the OES and into a vacuum pump, thus bypassing the reaction chamber.

Abstract: A device for limiting travel of a valve including a body removably connected to a transfer module, a vacuum valve, or a reaction chamber, a travel limiting rod passing through the body to engage and limit travel of the valve, and wherein the body includes at least one mounting flange opposite the travel limiting rod.

Abstract: A device for limiting travel of a valve including a body removably connected to a transfer module, a vacuum valve, or a reaction chamber, a travel limiting rod passing through the body to engage and limit travel of the valve, and wherein the body includes at least one mounting flange opposite the travel limiting rod.

Abstract: An apparatus for processing a wafer including a reaction chamber having a reaction space for processing the wafer, a susceptor positioned within the reaction chamber and having a sidewall, at least one light source positioned outside of the reaction space, at least one window in the reaction chamber, and wherein the at least one light source is directed through the at least one window to contact the sidewall.

Abstract: An apparatus for processing a wafer including a reaction chamber having a reaction space for processing the wafer, a susceptor positioned within the reaction chamber and having a sidewall, at least one light source positioned outside of the reaction space, at least one window in the reaction chamber, and wherein the at least one light source is directed through the at least one window to contact the sidewall.

Abstract: Methods and apparatus are provided for calibrating a chemical mechanical polishing (“CMP”) tool having a polishing station with a platen, an eddy current probe disposed within the platen, a polishing pad coupled to the platen, and a metal element disposed within the polishing station and configured to be selectively moved proximate the polishing pad. The method includes the steps of determining a thickness measurement of the polishing pad and adjusting at least one tool parameter based, in part, upon the determined thickness measurement of the polishing pad.