Abstract: A computing device includes memory configured for storing executable instructions, a processor configured for executing the instructions, a foldable display layer configured for displaying information in response to the execution of the instructions, and a bend limit layer coupled to the foldable display layer and arranged substantially parallel to a display surface of the foldable display layer. The bend limit layer is configured to increase its stiffness non-linearly when a radius of a bend of the bend limit layer is less than a threshold radius of curvature of the foldable display layer, the threshold radius of curvature being greater than 1 mm and less than 20 mm.

Abstract: This document describes techniques for implementing phase-change cooling in a three-dimensional structure. A three-dimensional structure having three-dimensional curvatures is fabricated to include a phase-change chamber with a fluid in a saturated thermodynamic state. As part of fabrication, specific mechanisms may be included that create a thermo-mechanical network that improves thermal performance of the phase-change chamber and also provides structural integrity to the three-dimensional structure.

Abstract: A computing device includes memory configured for storing executable instructions, a processor configured for executing the instructions, a foldable display layer configured for displaying information in response to the execution of the instructions, and a bend limit layer coupled to the foldable display layer and arranged substantially parallel to a display surface of the foldable display layer. The bend limit layer is configured to increase its stiffness non-linearly when a radius of a bend of the bend limit layer is less than a threshold radius of curvature of the foldable display layer, the threshold radius of curvature being greater than 1 mm and less than 20 mm.

Abstract: Disclosed herein are methods and apparatuses for the transmission of audio information from a bone-conduction headset to a user. The bone-conduction headset may be mounted on a glasses-style support structure. The bone-conduction transducer may be mounted near where the glasses-style support structure approach a wearer's ears. In one embodiment, an apparatus has a bone-conduction transducer with a diaphragm configured to vibrate based on a magnetic field. The magnetic field being based off an applied electric field. The apparatus may also have an anvil coupled to the diaphragm. The anvil may be configured to conduct the vibration from the bone-conduction transducer. Additionally, the anvil may be coupled to a metallic component. The metallic component may be configured to couple to a magnetic field created by the bone-conduction transducer.

Abstract: Opto-mechanical systems, methods of assembly, and devices utilizing opto-mechanical systems are disclosed. One example opto-mechanical system includes an optics housing; an optics display; and a display module. The optics display can extend away from a first open end of the optics housing to display images to a user. A display module is positioned adjacent a second open end of the optics housing. The display module may be constructed and arranged to project images onto the optics display. The display module further comprises a display module housing, as well as module displays that are positioned within the display module housing. The optics housing may be constructed and arranged to join the display module to the optics housing. The display module can be positioned within the optics housing and is spaced a predetermined distance away from the first surface of the optics display.

Abstract: Disclosed herein are methods and apparatuses for the transmission of audio information from a bone-conduction headset to a user. The bone-conduction headset may be mounted on a glasses-style support structure. The bone-conduction transducer may be mounted near where the glasses-style support structure approach a wearer's ears. In one embodiment, an apparatus has a bone-conduction transducer with a diaphragm configured to vibrate based on a magnetic field. The magnetic field being based off an applied electric field. The apparatus may also have an anvil coupled to the diaphragm. The anvil may be configured to conduct the vibration from the bone-conduction transducer. Additionally, the anvil may be anvil may include at least one passage configured to enable the anvil to be physically coupled to the diaphragm. Thus, the anvil may be coupled to the diaphragm after the anvil is positioned on the diaphragm.

Abstract: Disclosed herein are methods and apparatuses for the transmission of audio information from a bone-conduction headset to a user. The bone-conduction headset may be mounted on a glasses-style support structure. The bone-conduction transducer may be mounted near where the glasses-style support structure approach a wearer's ears. In one embodiment, an apparatus has a bone-conduction transducer with a diaphragm configured to vibrate based on a magnetic field. The magnetic field being based off an applied electric field. The apparatus may also have an anvil coupled to the diaphragm. The anvil may be configured to conduct the vibration from the bone-conduction transducer. Additionally, the anvil may be anvil may include at least one component configured to change properties to enable the bone-conduction headset to couple to the head of a user with greater than a threshold amount of force.

Abstract: Disclosed herein are methods and apparatuses for the transmission of audio information from a bone-conduction headset to a user. The bone-conduction headset may be mounted on a glasses-style support structure. The bone-conduction transducer may be mounted near where the glasses-style support structure approach a wearer's ears. In one embodiment, an apparatus has a bone-conduction transducer with a diaphragm configured to vibrate based on a magnetic field. The magnetic field being based off an applied electric field. The apparatus may also have an anvil coupled to the diaphragm. The anvil may be configured to conduct the vibration from the bone-conduction transducer. Additionally, the anvil may be coupled to a metallic component. The metallic component may be configured to couple to a magnetic field created by the bone-conduction transducer.

Abstract: Disclosed herein are methods and apparatuses for the transmission of audio information from a bone-conduction headset to a user. The bone-conduction headset may be mounted on a glasses-style support structure. The bone-conduction transducer may be mounted near where the glasses-style support structure approach a wearer's ears. In one embodiment, an apparatus has a bone-conduction transducer with a diaphragm configured to vibrate based on a magnetic field. The magnetic field being based off an applied electric field. The apparatus may also have an anvil coupled to the diaphragm. The anvil may be configured to conduct the vibration from the bone-conduction transducer. Additionally, the anvil may be coupled to a metallic component. The metallic component may be configured to couple to a magnetic field created by the bone-conduction transducer.

Abstract: Opto-mechanical systems, methods of assembly, and devices utilizing opto-mechanical systems are disclosed. One example opto-mechanical system includes an optics housing; an optics display; and a display module. The optics display can extend away from a first open end of the optics housing to display images to a user. A display module is positioned adjacent a second open end of the optics housing. The display module may be constructed and arranged to project images onto the optics display. The display module further comprises a display module housing, as well as module displays that are positioned within the display module housing. The optics housing may be constructed and arranged to join the display module to the optics housing. The display module can be positioned within the optics housing and is spaced a predetermined distance away from the first surface of the optics display.

Abstract: A hybrid pin-fin micro heat pipe heat sink consists of a plurality of heat pipes secured to a base. The heat pipes have a generally hollow cross-section which transitions from a first cross-sectional shape (e.g., circular) to a second cross-sectional shape (e.g., triangular). A heat transfer medium (e.g., saturated steam) is sealed within the heat pipes. Cooling plates may be disposed over the base with the heat pipes in physical contact with and passing through the cooling plates. The method of manufacturing the heat pipes consists of passing a heat transfer medium through a pipe section having a first cross-sectional shape while transitioning to a second cross-sectional shape (e.g., by way of a rolling die press), then crimping the ends closed to seal the heat transfer medium therein.

Abstract: An apparatus for positioning an object, for example, a solar energy capture device, can include a frame, the object, a joint, and at least two linear actuators. The joint connects the object to the frame and allows the object to rotate relative to the frame. The first and second linear actuators are coupled to the object. When the first and second actuators are actuated in combination, the object rotates about a pitch axis. When the first and second actuators are actuated differentially, the object rotates about a roll axis.

Abstract: A hybrid pin-fin micro heat pipe heat sink comprises a plurality of heat pipes secured to a base. The heat pipes have a generally hollow cross-section which transitions from a first cross-sectional shape (e.g., circular) to a second cross-sectional shape (e.g., triangular). A heat transfer medium (e.g., saturated steam) is sealed within the heat pipes. Cooling plates may be disposed over the base with the heat pipes in physical contact with and passing through the cooling plates. The method of manufacturing the heat pipes comprises passing a heat transfer medium through a pipe section having a first cross-sectional shape while transitioning to a second cross-sectional shape (e.g., by way of a rolling die press), then crimping the ends closed to seal the heat transfer medium therein.

Abstract: A method of printing spots with high spot placement accuracy using print heads with random/unevenly spaced ejector locations and coarse alignment of the multiple print heads. This is performed by accurately determining the spot positions from all the print heads using a vision system and printing at high addressability. The spot placement accuracy will be determined by the addressability as long as the ejected drop position is reproducible and other system errors are negligible.

Abstract: A method of printing spots with high spot placement accuracy using print heads with random/unevenly spaced ejector locations and coarse alignment of the multiple print heads. This is performed by accurately determining the spot positions from all the print heads using a vision system and printing at high addressability. The spot placement accuracy will be determined by the addressability as long as the ejected drop position is reproducible and other system errors are negligible.

Abstract: The invention provides devices for analyzing genetic material comprising a substrate and a first genetic material position and a second genetic material position on the substrate that each comprise genetic material attached to the substrate. The invention also provides methods of distributing genetic material comprising distributing at least one device.

Abstract: The invention provides devices for analyzing genetic material comprising a substrate and a first genetic material position and a second genetic material position on the substrate that each comprise genetic material attached to the substrate. The invention also provides methods of distributing genetic material comprising distributing at least one device.

Abstract: An electronic apparatus, e.g., a lap top computer, has an enclosure which on its inner surface is coated with a phase-change material, e.g., in micro encapsulated form, preferably mixed with paint which is used to coat the inner surface of the enclosure. The phase change material absorbs heat generated by components in the electronic apparatus and maintains the components in the apparatus at a reasonable temperature.

Abstract: A thernopneumatic valve comprises a fluid channel plate defining a fluid port. A diaphragm plate is attached to the fluid channel plate. The diaphragm plate includes a displaceable diaphragm to selectively obstruct the fluid port of the fluid channel plate. A thermal isolating heater is connected to the diaphragm plate. The thermal isolating heater includes a thermal isolating heater body with a heating surface, a perimeter wall defining an extended axial cavity to confine a thermopneumatic working fluid that is used to control the position of the displaceable diaphragm, and a diaphragm obstruction structure to limit the motion of the displaceable diaphragm into the extended axial cavity.

Abstract: Disclosed is a semiconductor package and method in which a semiconductor chip is mounted within the opening of a lead frame by bonding wires extending between the active front side of the chip and bonding pads of the lead frame, and the lead frame/chip assembly is encased within a plastic molded body, with the inactive back side of the chip exposed and facing outside the package.