Patents by Inventor John T. Berry

John T. Berry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240102414
    Abstract: A ball valve for a ball valve assembly having a housing with a housing sealing surface configured to selectively seal against the ball valve. The ball valve includes an outer sealing surface configured to selectively seal against the housing sealing surface, and a recessed surface set inward of the outer sealing surface and defining a reservoir within the outer sealing surface. As the ball valve rotates between open and closed positions, the reservoir establishes a gap between the recessed surface and the housing sealing surface that enables debris to pass therethrough and facilitate preventing debris accumulation between the ball valve and the housing sealing surface.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 28, 2024
    Inventors: Arturo L Klisowski, Eduardo Fernandes Goncalves, John M Price, Joseph T Berry, Ronald A Dallison
  • Patent number: 6934642
    Abstract: A novel economical method for determining the residual stress levels in machined, mechanically or thermally processed components and for determining whether the stress is tensile or compressive. Also provided is a system including components for accomplishing the method of the present invention. Also provided is a method of modeling of a component residual stress from production of raw billet through to a finished component.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: August 23, 2005
    Assignee: Mississippi State University
    Inventors: John T. Berry, John E. Wyatt
  • Publication number: 20040267462
    Abstract: A novel economical method for determining the residual stress levels in machined, mechanically or thermally processed components and for determining whether the stress is tensile or compressive. Also provided is a system including components for accomplishing the method of the present invention. Also provided is a method of modeling of a component residual stress from production of raw billet through to a finished component.
    Type: Application
    Filed: April 16, 2004
    Publication date: December 30, 2004
    Inventors: John T. Berry, John E. Wyatt
  • Patent number: 5033948
    Abstract: The solid metal to be melted is placed on a support, within an induction coil which is adapted to provide a greater electromagnetic force towards the lower portion of the quantity of metal. When energy is provided to the coil, the metal melts from the top downward, but the concentration of electromagnetic force towards the bottom of the metal causes the liquid metal to retain a cylindrical shape. When most of the metal is melted, the liquid metal passes through an opening in the support. In a preferred embodiment, the coil is movable relative to the quantity of metal, and at the beginning of the melting process only the top portion of the quantity of metal is disposed within the coil. As the quantity of metal melts, the coil is moved downward. The method may also be used for removing impurities from the quantity of metal.
    Type: Grant
    Filed: April 6, 1990
    Date of Patent: July 23, 1991
    Assignee: Sandvik Limited
    Inventors: Nagy H. El-Kaddah, Thomas S. Piwonka, John T. Berry
  • Patent number: 5014769
    Abstract: The solid metal to be melted is placed within an induction coil which is adapted to provide a greater electomagnetic force towards the lower portion of the quantity of metal. The solid metal rests on a support, having an opening therethrough, which is kept at a low temperature relative to the metal as it melts. When energy is provided to the coil, the metal melts from the top downward, but the concentration of electromagnetic force towards the bottom of the metal causes the liquid metal to retain a cylindrical shape. When most of the metal is melted, the liquid metal passes through the opening in the support into a casting mold.
    Type: Grant
    Filed: April 17, 1989
    Date of Patent: May 14, 1991
    Assignee: Inductotherm Corp.
    Inventors: Nagy H. El-Kaddah, Thomas S. Piwonka, John T. Berry