Abstract: The present invention provides an injection nozzle for mixing an initiator with a process fluid. Then injection nozzle comprises a body comprising an inlet port, and outlet port, and an injector inlet; a process fluid flow passage; an initiator flow fluid passage; and a stylus. The process fluid flow passage comprises a constricting portion and an expanding portion to help improve transport and mixing. The injection nozzle is useful for injecting a fluid into another fluid at elevated temperatures and pressures, and for maximizing mixing of the fluids.

Abstract: An initiator injection nozzle for mixing an initiator with a process fluid, comprising: a body comprising an inlet port to receive the process fluid, an outlet port, and an injector inlet to receive initiator; a process fluid flow passage through which the process fluid traverses between the inlet port and outlet port along a central process flow axis, further comprising a constricting portion, a throat, and an expanding portion in that order, —an initiator fluid flow passage through which the initiator traverses between the injector inlet and injector outlet along an injector central vertical axis, where the initiator fluid flow passage intersects the process fluid flow passage in the constricting portion; a stylus at least partially containing the initiator fluid flow passage and further comprising a shaped injector tip forming the injector outlet of the initiator fluid flow passage; where the injector outlet is located in the constricting portion of the process fluid flow passage and upstream of the throat

Abstract: A tube reactor system containing a process fluid, comprising: at least one fresh feed source for supplying ethylene into a process fluid; a primary compressor for pressurizing the process fluid to reaction conditions in fluid communication with both the at least one fresh feed source and a recycle conduit; a reactor tube for converting a portion of the ethylene and optionally at least one comonomer within the process fluid into a low density ethylene-based polymer and a remaining portion of ethylene in fluid communication with the primary compressor; a high pressure separator for separating the low density ethylene-based polymer from the remaining portion of ethylene in fluid communication with the reactor tube; the recycle conduit in fluid communication with the high pressure separator for conveying the remaining portion of ethylene to the primary compressor; where the improvement comprises a reactor tube further comprising at least one initiator injection nozzle in fluid communication with an initiator s

Abstract: The present invention features apparatus and a method for forming a highly-compliant interface structure between interconnection pads on a substrate, such as a printed circuit board, and a semiconductor chip. A thin dielectric layer is deposited over an interconnection pad. A metallized pattern is deposited over the dielectric layer, the pattern typically being a rectangular grid, concentric, annular rings, or a wave-like spiral. A portion of the dielectric layer may be removed from beneath at least a portion of the metallized pattern, thereby allowing flexing of the metallized pattern. A solder mask may be placed over the metallized pattern. Finally, a solder ball or epoxy for forming a typical BGA bond is placed at an opening in the solder mask. Unequal thermal expansion of the substrate and the chip are thereby compensated for by lateral and/or vertical flexure of the metallized grid. Thermal stress of the solder connection and resultant cracking are thereby eliminated.

Abstract: The present invention comprises a high performance single chip or multi-chip package which combines a CTE controlled electronic substrate, a multi-layer interconnect, bare dice or packaged devices, a top layer encapsulant and an interposer to provide a compliant and de-mountable connection to a printed circuit board. The CTE controlled electronic substrate comprises a metal or composite shell around an encapsulated core holding vertical electrical conductors. The vertical connection comprises an array of stranded or braided electrical conductors which may be exposed on the top and or bottom of the electronic substrate to provide a de-mountable interface. An interconnect layer may be attached to the planar CTE controlled electronic substrate using an adhesive or polymer. Following the connection of the interconnect to the substrate, the bare dice and/or package may be attached to the interconnect.

Abstract: A method of coating conductors with polyvinyl formal dissolved in a solvent comprising certain monoalkyl ethers of diethylene glycol and triethylene glycol or the monophenyl ether of ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol or propylene glycol. In some cases it is necessary to have a diluent such as an aromatic hydrocarbon present.

Abstract: Polyvinyl formal dissolved in a solvent comprising certain monoalkyl ethers of diethylene glycol and triethylene glycol or the monophenyl ether of ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol or propylene glycol. In some cases it is necessary to have a diluent such as an aromatic hydrocarbon present.

Abstract: Polyester-imide resins are prepared which are soluble in non-phenolic solvents by incorporating a monoether of a diethylene glycol or triethylene glycol into the resin.

Abstract: Polyester-imide resins are prepared which are soluble in non-phenolic solvents by incorporating a monoether of a diethylene glycol or triethylene glycol into the resin.

Abstract: Polyester-imide resins are prepared which are soluble in non-phenolic solvents by incorporating a monoether of a diethylene glycol or triethylene glycol into the resin.

Abstract: Amide-imide-hydantoin polymers are prepared from trimellitic anhydride, a diisocyanate and reacting the isocyanate terminated amide-imide with a glycine derivative of the formula ##STR1## WHERE R is aromatic, R.sub.1 are the same or different and are hydrogen or alkyl, R.sub.2 is dialkylamino, alkoxy or aroxy and x is an integer from 2 to 4. A portion of the trimellitic anhydride can be replaced by a dicarboxylic acid, a dianhydride or a tribasic acid. The products are soluble in cresol type solvent.