Abstract: A novel HDI board that enables test probe access comprises a stack of insulating layers having a first surface and a second surface, wherein the first surface includes at least two devices and the second surface includes a test probe accessible solder bead. The two devices are electrically coupled by at least one metal interconnect formed within the plurality of insulating layers. The HDI board also includes a backside ?Via electrically coupling the solder bead to the metal interconnect. Testing of the device may be carried out by way of the solder bead and the backside ?Via.

Abstract: In some embodiments a memory module circuit board includes a first surface adapted to couple a first plurality of memory devices, a plurality of signal lines, and a command and address bus coupled to the signal lines. The command and address bus is routed from the signal lines and adapted to couple to at least one of the first plurality of memory devices in a manner that does not require the command and address bus lines to turn more than approximately ninety degrees before coupling to the at least one of the first plurality of memory devices. Other embodiments are described and claimed.

Abstract: A power supply system, a circuit board, and a computer, as well as a method of providing power to a circuit element are disclosed. The power supply system may include two or more voltage sources coupled to a circuit element. The voltage output of one voltage source may be coupled to one portion of a plurality of power and return connection terminals on the circuit element, and the voltage output of another voltage source may be coupled to another portion of the plurality of power and return connection terminals. The method may include selecting the portions of the power and return connection terminals, and connecting voltage sources to the selected portions.

Abstract: A circuit board assembly is provided, comprising a first circuit board and a ball-grid array jumper. The ball-grid array jumper comprises a second circuit board smaller in size than the first printed circuit board and has at least one layer of conductive traces and at least two solder ball connectors. The ball grid array jumper is mounted to the first printed circuit board via the solder ball connectors.

Abstract: A circuit board assembly is provided, comprising a first circuit board and a ball-grid array jumper. The ball-grid array jumper comprises a second circuit board smaller in size than the first printed circuit board and has at least one layer of conductive traces and at least two solder ball connectors. The ball grid array jumper is mounted to the first printed circuit board via the solder ball connectors.

Abstract: A power supply system, a circuit board, and a computer, as well as a method of providing power to a circuit element are disclosed. The power supply system may include two or more voltage sources coupled to a circuit element. The voltage output of one voltage source may be coupled to one portion of a plurality of power and return connection terminals on the circuit element, and the voltage output of another voltage source may be coupled to another portion of the plurality of power and return connection terminals. The method may include selecting the portions of the power and return connection terminals, and connecting voltage sources to the selected portions.

Abstract: A circuit board includes electrical interconnect mounting pads for mounting electronic devices thereto. Some of the electrical interconnect mounting pads include a plated through hole which traverses through the circuit board. One end of the plated through holes is closed, plugged or covered to prevent migration of solder through the plated through holes during a solder operation. The reduction in solder migration, as a result of plugging the plated through hole, increases solder joint quality over solder joint quality achieved using plated through holes which are not closed at one end.

Abstract: A multi-layer printed circuit board includes power planes located on outer conductive layers. The outer conductive layers are patterned to accept circuitry, such as integrated circuits and surface mount devices. Mounting pads are provided on the outer conductive layers which include plated through vias for electrical interconnection with other conductive layers of the printed circuit board. To increase solderability, the plated through vias are located on the mounting pads such that they are covered by the circuit component mounted thereto. By locating the vias under the electrical components, such as surface mount capacitors, the quality of solder fillets is increased. To enhance heat dissipation, openings are provided in solder masks located on exterior surfaces of the outer conductive planes. These openings are located in the solder mask to expose the conductive plane. As such, the openings are located in areas where circuitry is not mounted to the printed circuit board.

Abstract: Disclosed is a multilayer (e.g., 4-layer) printed circuit board and method of manufacture thereof. The multilayer printed circuit board has at least one inner substrate (inner core) that includes a phenolic resin (e.g., a phenolic resin-laminated paper). Outer insulating layers of the multilayer printed circuit board can have a low dielectric constant (e.g., 3.8-4.4) and a high Tg (e.g., 180°-200° C.). The multilayer printed circuit board can be provided by steps including forming electrical circuit patterns from a copper foil on the inner substrate, to form a printed circuit board, forming a stack of at least one printed circuit board and outer copper foil layers, with insulating layers of, e.g., a semi-cured resin (e.g., prepreg layers) interposed between adjacent conductive metal layers, and then laminating the stack.