Abstract: A cooling plate for heat dissipation is particularly adapted for use within printed circuit board stacks. The cooling plate includes a fluid inlet manifold, fluid pass containing a plurality of heat dissipation fins, and a fluid outlet manifold. Externally, the cooling plate has a pattern of heat conductive pads that is substantially identical to the pattern of devices on a printed circuit board attached to the cooling plate. The cooling plate includes apertures and mounting elements for z-axis connector assemblies so that printed circuit boards attached to either side of the cooling plate may electrically interconnect.

Abstract: A seal for use in sealing an annular opening between a stationary member and a rotating cylinder telescopically arranged with the stationary member, the seal comprising a series of partially overlapping members circumscribing the cylinder adjacent the stationary member and closing the annular opening. The seal comprises a series of self-biasing leaf members attached to the stationary member and being biased into sealing engagement with the rotating member and a series of blanket members positioned adjacent the seal members to prevent leakage from the gaps between adjacent leaf members to substantially seal the annular opening between the rotating and stationary members.

Abstract: An electrical edge connector (14) of the zero insertion force type includes a pair of opposing blocks (30, 32) defining a longitudinal guideway (34) therebetween. Opposite corresonding pairs of female contacts (52, 54) are disposed in transverse holes in the blocks (30, 32), and male contacts (60) are slidably supported in the female contacts in one block for selective actuation into or out of sliding engagement with the female contacts in the other block responsive to insertion of a slider (36).

Abstract: A circuit module (10) having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module (10) includes a circuit board assembly (12) with a plurality of electronic devices (26) such as integrated circuits, mounted on a circuit board (28). The circuit board (28) includes conductive pads (42 and 44) and plated-through holes (46) forming a thermally conductive flow path from each electronic device (26) to the opposite side of the circuit board for more efficient heat transfer away from the module (10). The heat pads (42 and 44) and plated-through holes (46) are preferably connected with the ground plane layer (36) of the circuit board (28) for better heat distribution as well.

Abstract: A circuit module (10) having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module (10) includes a circuit board assembly (12) with a plurality of electronic devices (26) such as integrated circuits, mounted on a circuit board (28). The circuit board (28) includes conductive pads (42 and 44) and plated-through holes (46) forming a thermally conductive flow path from each electronic device (26) to the opposite side of the circuit board for more efficient heat transfer away from the module (10). The heat pads (42 and 44) and plated-through holes (46) are preferably connected with the ground plane layer (36) of the circuit board (28) for better heat distribution as well.

Abstract: The specification discloses an interconnected multiple circuit module (10) including a connector assembly (14) for interconnecting two circuit modules (12) each having at least one circuit board assembly (16). The connector assembly (14) includes pins (26) extending through the circuit board assemblies (16) and a free connector block (28) for receiving the pins in opposite ends. The pins (26), connector block (28) and contacts (40) within the block are preferably adapted to provide differential mechanical resistances on opposite ends of the block between the pins to facilitate controlled predictable electrical connection of the circuit modules (12).