Patents by Inventor John Thomas Maddix

John Thomas Maddix has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro probe ring assembly and method of fabrication
    Patent number: 6232143
    Abstract: A multi-probe ring assembly including integral fine probe tips, conductive lines with terminal connection for testing semiconductor devices and a method of construction of the multi-probe ring assembly is described. The method of construction described utilizes the step of etching pits into silicon wafers to produce molds for forming the probe points. Semiconductor machining processes are used to complete the probe ring assembly.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: May 15, 2001
    Assignee: International Business Machines Corporation
    Inventors: John Thomas Maddix, Anthony Michael Palagonia, Paul Joseph Pikna, David Paul Vallett
  • Micro probe assembly and method of fabrication
    Patent number: 6059982
    Abstract: A probe assembly including an integral fine probe tip, conductive line with terminal connection for testing semiconductor devices and a method of construction of the probe assembly is described. The method of construction described utilizes the step of etching pits into silicon wafers to produce molds for forming the probe point. Semiconductor machining processes are used to complete the probe assembly.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: May 9, 2000
    Assignee: International Business Machines Corporation
    Inventors: Anthony Michael Palagonia, Paul Joseph Pikna, John Thomas Maddix
  • Micro probe ring assembly and method of fabrication
    Patent number: 6014032
    Abstract: A multi-probe ring assembly including integral fine probe tips, conductive lines with terminal connection for testing semiconductor devices and a method of construction of the multi-probe ring assembly is described. The method of construction described utilizes the step of etching pits into silicon wafers to produce molds for forming the probe points. Semiconductor machining processes are used to complete the probe ring assembly.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: January 11, 2000
    Assignee: International Business Machines Corporation
    Inventors: John Thomas Maddix, Anthony Michael Palagonia, Paul Joseph Pikna, David Paul Vallett