Abstract: A content-addressable, first-in/first-out memory (CAM-FIFO), as used to provide a read-modify-write buffer for data between two processes, includes: a Content Addressable Memory (CAM) which stores flag data; a FIFO memory portion for providing data storage; a write/read address counting section for providing write/read addresses of data to be stored in/read from the FIFO; and logic to determine and is used to query data on the queue to determine if the FIFO data should still be sent to the receiving process, or replaced with at least part of the flag data.

Abstract: An ultrasonic imaging system which uses transform beamforming in a two-dimensional context includes a two-dimensional array of transducer elements, a plurality of groups of local busses, and a plurality of sets of switching circuits. Each transducer element has a signal electrode coupled to a corresponding set of switching circuits which is controlled so that a particular transducer element is selectively coupled to one of the associated group of local busses. Each local bus provides an output signal that is sent from the probe to the console via a respective coaxial cable for each group of local busses. The number of connections that are necessary to be made through each coaxial cable is reduced by the ratio of the number of transducer elements coupled to a set of local busses and the number of busses in that set. Each set of local busses provides the input transform signals to one transform section of the transform preprocessor.

Abstract: The present invention discloses an acoustic composite material for an ultrasonic phased array and a method for making. The acoustic composite material is formed from a microcapillary array having a plurality of holes of a constant cross-section and volume fraction. In each of the plurality of holes of the microcapillary array, a polymer fill is deposited therein. The polymer filled microcapillary array is cut at an axis perpendicular to the microcapillary array into a plurality of sections. Each of the plurality of sections are then ground into a predetermined thickness and bonded to a phased array of piezoelectric elements and backfill material.