Abstract: A ferrite layer formation process that may be performed at a lower temperature than conventional ferrite formation processes. The formation process may produce highly anisotropic structures. A ferrite layer is deposited on a substrate while the substrate is exposed to a magnetic field. An intermediate layer may be positioned between the substrate and the ferrite to promote bonding of the ferrite to the substrate. The process may be performed at temperatures less than 300° C. Ferrite film anisotropy may be achieved by embodiments of the invention in the range of about 1000 dyn-cm/cm3 to about 2×106 dyn-cm/cm3.

Abstract: An antenna structure including at least one planar antenna element. In place of a balun, the antenna structure further includes a slotline for coupling the planar antenna element with an unbalanced load.

Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent.

Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent.

Abstract: Cracking in thin sheets of sol-gel-produced material is avoided by use of a support liquid during gelation and drying. Silica glass, as well as other glass and ceramic bodies, is contemplated.

Abstract: An inductor (100) optimized for surface-mount vacuum-pickup automated circuit assembly eliminates the expense of an inductor housing. The inductor has a hollow rectangular ferrite core (101) and a winding defined by a stripline (102) deposited on the core surface. Winding ends are formed by conductive vias (103) in the core that open onto the core surface, where they connect and mount the inductor to a circuit board (150). A flat sheet (104) adhered to one face of the core provides a surface for vacuum pickup and for labeling of the inductor. The core of a passively tuneable inductor (200) defines multiple unconnected winding segments (102-103). Segment ends mount the inductor to the circuit board and connect the segments to circuit board striplines (254) that are laid out in a pattern to interconnect a number of the segments into a winding. The inductor is tuned by changing the stripline layout and thereby varying the number of interconnected segments.

Abstract: A transformer (FIG. 1) optimized for surface-mount vacuum-pickup automated circuit assembly eliminates the expense of a transformer housing. The transformer has a ferrite body (100) that defines a pair of wells (208, 209) each opening onto an opposite face (108, 109) of the ferrite body. Transformer primary and secondary windings are wound in a coil (103) through slots (210, 211) around a transformer core (204) at the bottom of the wells. The windings do not protrude from the wells beyond the faces, resulting in flat faces. A first plurality of conductive vias (104-106), one pair for each winding, are completely embedded in the ferrite body and extend to both of the faces. Each pair of vias serves at one face to attach to the winding and at the other face to attach to solder pods of a PC board. The embedded vias also serve as EMI filters. A plate (107) covers the one face and provides a surface for vacuum pickup and for labeling of the transformer. The ferrite body (500) of a first transformer (FIG.

Abstract: The method of making a metallized magnetic substrate for devices including a magnetic component involves providing an unfired ceramic body. In one exemplary embodiment, the method further involves making one or more vias through the ceramic body, coating the via side walls with conductive material, forming an aperture through the ceramic body, such that an aperture edge intersects the via, and metallizing the unfired ceramic body such that a conductive pathway is formed that includes the conductive material in the via. Finally, the metallized unfired ceramic body is fired in conventional fashion, optionally followed by deposition of additional conductor material.

Abstract: The present invention provides improved techniques for metallizing ceramic substrates. The method comprises providing a ceramic substrate and depositing a layer of reducible material on the ceramic substrate. The layer of reducible material includes a reducible ceramic such as copper oxide. The ceramic substrate having the layer of reducible material disposed thereon is heated and the reducible material is contacted with a reducing agent to create a conductive region. The conductive region is either a metallized region formed by reduction, or it is a conductive ceramic formed through surface reduction. The present invention further provides a metallized ceramic substrate. The metallized layer comprises ceramic regions having at least one constituent in common with the ceramic substrate. The ceramic substrate and the ceramic regions of the metallized layer are sintered to each other such that the metallized region is interspersed between the sintered ceramic regions.

Abstract: The pillar structure according to the invention has a substantially longer surface path length from negative to positive electrodes resist breakdown in a high voltage environment. The processing and assembly methods in this invention permit low-cost manufacturing of high breakdown-voltage, dielectric pillars for the flat panel display.

Abstract: In accordance with the invention, a field emission device is made by disposing emitter material on an insulating substrate, applying a sacrificial film to the emitter material and forming over the sacrificial layer a conductive gate layer having a random distribution of apertures therein. In the preferred process, the gate is formed by applying masking particles to the sacrificial film, applying a conductive film over the masking particles and the sacrificial film and then removing the masking particles to reveal a random distribution of apertures. The sacrificial film is then removed. The apertures then extend to the emitter material. In a preferred embodiment, the sacrificial film contains dielectric spacer particles which remain after the film is removed to separate the emitter from the gate. The result is a novel and economical field emission device having numerous randomly distributed emission apertures which can be used to make low cost flat panel displays.

Abstract: The thickness uniformity of a plated metal layer inside a via hole can be enhanced by intersecting a conductive via with an insulating aperture before plating. The new via configuration improves the mass transfer of the plating. It is believed that the apertures lower the local solution ohmic resistance near the via holes. The method can be applied to the manufacture of a wide variety of circuit boards.

Abstract: In accordance with the invention, a field emission device is made by disposing emitter material on an insulating substrate, applying a sacrificial film to the emitter material and forming over the sacrificial layer a conductive gate layer having a random distribution of apertures therein. In the preferred process, the gate is formed by applying masking particles to the sacrificial film, applying a conductive film over the masking particles and the sacrificial film and then removing the masking particles to reveal a random distribution of apertures. The sacrificial film is then removed. The apertures then extend to the emitter material. In a preferred embodiment, the sacrificial film contains dielectric spacer particles which remain after the film is removed to separate the emitter from the gate. The result is a novel and economical field emission device having numerous randomly distributed emission apertures which can be used to make low cost flat panel displays.

Abstract: The disclosed multi-pixel flat panel displays (e.g., flat panel field emission displays (FPFED) or liquid crystal displays (LCD)) includes spaced apart first and second electrodes, with a patterned solid material layer in contact with one of the electrodes, exemplarily between the two electrodes. The patterned layer (referred to as the "web") includes a multiplicity of apertures, with at least one (preferably three or more) aperture associated with a given pixel. In the aperture is disposed a quantity of a second material, exemplarily, a phosphor in the case of an FPFED, or a color filter material in the case of a LCD. The web can facilitate second material deposition by means of, e.g., screen printing, typically making possible formation of smaller phosphor or filter dots than was possible by prior art device. The web also can facilitate provision of spacer structure between the two electrodes, and can include getter or hygroscopic material.

Abstract: Magnetic components are fabricated as monolithic structures using multilayer co-fired ceramic tape techniques. Fabrication of these magnetic components involves constructing multiple layers of a magnetic material and an insulating non-magnetic material to form a monolithic structure with well defined magnetic and insulating non-magnetic regions. Windings are formed using screen printed conductors connected through the multilayer structure by conducting vias.

Abstract: Magnetic components are fabricated as monolithic structures using multilayer co-fired ceramic tape techniques. Fabrication of these magnetic components involves constructing multiple layers of a magnetic material and an insulating non-magnetic mataerial to form a monolithic structure with well defined magnetic and insulating non-magnetic regions. Windings are formed using screen printed conductors connected through the multilayer structure by conducting vias.

Abstract: Multilayer magnetic components can be made with reduced cracking and magnetic degradation by forming layers having patterns of magnetic and insulating regions separated by regions that are removable during sintering. Advantageously, when the layers are stacked, layers of removable material are also disposed between magnetic regions and insulating regions so as to produce upon sintering a magnetic core within an insulating body wherein the core is substantially completely surrounded by a thin layer of free space.

Abstract: This invention concerns with microwave devices including resonant elements made from dielectric materials represented by the nominal formulas Ba.sub.2 Ti.sub.9 O.sub.20, BaTi.sub.4 O.sub.9, ZrTiO.sub.4 (Sn) and the like. The resonant element is produced conventionally by a process including numerous steps of mixing, drying, screening, calcining, ball milling, drying, screening or remilling and spray drying, forming and sintering. These steps may take 72 hours or more, prior to the forming step, and are labor and energy consuming. The improvement resides in the use of a reduced number of steps which include mixing precursor powders with addition of water and dispersants, spray drying or flocculating and drying the mixed formulation, forming and reactively sintering, so as to reduce the total processing time, prior to the forming step, to form about 8 to 24 hours.

Abstract: In accordance with the present invention, an integrated circuit package comprises a thermally conductive plate for receiving an integrated circuit and an open rectangular structure of conductor and insulator for surrounding the sides of the circuit and presenting one or more linear arrays of conductive connectors extending laterally through the rectangular structure. Preferably the rectangular structure also includes transverse contacts. Advantageously the plate includes extensions beyond the rectangular structure for acting as cooling fins on opposing sides of the rectangular structure. The linear arrays and cooling fins are preferably on different pairs of parallel sides.

Abstract: A process for the preparation of superconducting ceramic materials by a solid state reaction technique. The process is especially suited for production of powders including .gtoreq.95% of Ba.sub.2 YCu.sub.3 O.sub.7 for use in producing sintered ceramic bodies including >99% Ba.sub.2 YCu.sub.3 O.sub.7.