Abstract: A semiconductor wafer processing method, having: ablating a back side of a semiconductor wafer with a laser ablation process; and etching the back side of the semiconductor wafer with an etching process; wherein the laser ablation process forms a pattern in the back side of the semiconductor wafer; wherein the etching process preserves the pattern in the back side of the semiconductor wafer.

Abstract: A wave power generator is substantially continuously driven by a pair of floats connected to a common drive shaft and positioned side by side along a line perpendicular to the direction of wave motion, one float being specifically designed to efficiently drive the shaft during the rising portion of a wave, the other to efficiently drive the shaft during the falling portion of a wave. The generator's flywheel is maintained at a constant speed by an automatic load control throughout a range of wave patterns sufficient to encompass over 70% of the statistically expected wave patterns at the generator location. An inclined-bottom float is used for the rising wave drive, and a bottom-weighted float is disclosed for the falling wave drive. The floats may be disposed one above the other and may have mating conical surfaces for cushioning occasional contact between the floats.

Abstract: A float having depending fins and a curved surface on which waves impinge. The float provides an additional lift over and beyond its buoyancy. The float is coupled through a swivel to allow it to turn into the direction of waves. The float is additionally provided with an arrangement to compensate for variations in the mean water level due to tide action.

Abstract: A wave motion motor is disclosed with an impeller moved by a float. The float is coupled to a swivel arrangement to turn in the direction of wave current and has an inclined underside. Also disclosed are means to adjust to tide level and triangular coupling means between the float and a flywheel.