Abstract: A method and apparatus is provided for electrically interconnecting a circuit pattern with an adjacent circuit on a substrate. The circuit pattern is positioned in direct physical contact with the adjacent circuit to create a single electrical interface between the circuit pattern and the adjacent circuit. A compliant spring member is supported by the substrate for creating a normal force at the single electrical interface for holding the circuit pattern and adjacent circuit together. The compliant spring member is sufficiently flexible to facilitate electrical interconnection of the circuits along a non-planar substrate. Various embodiments are described.

Abstract: There is disclosed herein a self-shearing stencil for use in applying solder paste or other bonding material atop a printed circuit board (PCB) in a predefined pattern. The stencil 50 has a top surface 12, a bottom surface 14, a first surface cavity 16 in the top surface, and a second surface cavity 18 in the bottom surface proximate the first surface. The cavities 16/18 overlap in a predefined manner so as to be in open communication with each other. When the stencil is placed on the PCB, the cavities are filled with solder paste and the PCB is then lowered away from the stencil, whereupon a bottom ledge 26 (defined by the stencil material underneath the first cavity) shears off the solder paste in the first cavity from the paste in the second cavity.

Abstract: A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression headcap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. The compression headcap includes two generally parallel wiper blades that are biased into sliding communication with the stencil. Longitudinal diffuser plates guide and equalize the flow of the viscous material into the volume between two generally parallel wiper blades.

Abstract: An apparatus and a method for embedding conductors in a structure having a signal distribution function associated therewith such as a vehicle instrument panel are disclosed. The apparatus includes an embedding tool which can be positioned in three dimensional space to embed conductors in non-planar surfaces. A method for such embedding is also disclosed.

Abstract: A method, and an article produced according to the method, for embedding conductors in a structure having a signal distribution function associated therewith such as a vehicle instrument panel. The method includes embedding a conductor in a film, and molding a material to the film such that the material and the film integrally form the structure. The method also includes attaching a connector to the integral structure so that the connector is provided in communication with the conductor.

Abstract: An apparatus for cooling electronic devices/modules in a vehicle comprises a main ventilation duct mounted in the vehicle, and includes a blower for forcing air through the main duct. A bypass duct is provided in selective fluid communication with the main ventilation duct, and is adapted to carry electronic devices/modules to be cooled by air forced through the bypass duct. Inlet and outlet valves are provided for selectively varying the amount of air which passes through the bypass duct. The electronic devices may be positioned outside of the bypass duct, or inside the bypass duct if sealed.