Patents by Inventor John W. K. Lau

John W. K. Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally conductive elastomer containing alumina platelets
    Patent number: 5137959
    Abstract: Alpha alumina platelets are used as thermally conductive, electrically insulating filler in thermally conductive, electrically insulating elastomers. The platelets provide improved thermal conductivity in comparison to conventional alumina fillers. The platelets preferably average less than one micron thickness with an average aspect ratio of at least about 5:1.
    Type: Grant
    Filed: May 24, 1991
    Date of Patent: August 11, 1992
    Assignee: W. R. Grace & Co.-Conn.
    Inventors: Jacob Block, John W. K. Lau