Abstract: An electrochemical process for applying a conductive film onto a substrate having a seed layer includes placing the substrate into contact with an electrochemical plating bath containing cobalt or nickel, with the plating bath having pH of 4.0 to 9.0. Electric current is conducted through the bath to the substrate. The cobalt or nickel ions in the bath deposit onto the seed layer. The plating bath may contain cobalt chloride and glycine. The electric current may range from 1-50 milli-ampere per square cm. After completion of the electrochemical process, the substrate may be removed from the plating bath, rinsed and dried, and then annealed at a temperature of 200 to 400 C to improve the material properties and reduce seam line defects. The plating and anneal process may be performed through multiple cycles.

Abstract: An electrochemical process for applying a conductive film onto a substrate having a seed layer includes placing the substrate into contact with an electrochemical plating bath containing cobalt or nickel, with the plating bath having pH of 4.0 to 9.0. Electric current is conducted through the bath to the substrate. The cobalt or nickel ions in the bath deposit onto the seed layer. The plating bath may contain cobalt chloride and glycine. The electric current may range from 1-50 milli-ampere per square cm. After completion of the electrochemical process, the substrate may be removed from the plating bath, rinsed and dried, and then annealed at a temperature of 200 to 400 C to improve the material properties and reduce seam line defects. The plating and anneal process may be performed through multiple cycles.

Abstract: A method for depositing metal in a feature on a workpiece includes forming a seed layer in a feature on a workpiece, wherein the seed layer includes a metal selected from the group consisting of cobalt and nickel; electrochemically depositing a first metallization layer on the seed layer, wherein electrochemically depositing the metallization layer includes using a plating electrolyte having a plating metal ion and a pH in the range of 6 to 13; and heat treating the workpiece after deposition of the first metallization layer.

Abstract: An electrochemical process for applying a conductive film onto a substrate having a seed layer includes placing the substrate into contact with an electrochemical plating bath containing cobalt or nickel, with the plating bath having pH of 4.0 to 9.0. Electric current is conducted through the bath to the substrate. The cobalt or nickel ions in the bath deposit onto the seed layer. The plating bath may contain cobalt chloride and glycine. The electric current may range from 1-50 milli-ampere per square cm. After completion of the electrochemical process, the substrate may be removed from the plating bath, rinsed and dried, and then annealed at a temperature of 200 to 400 C to improve the material properties and reduce seam line defects. The plating and anneal process may be performed through multiple cycles.

Abstract: An electrochemical process for applying a conductive film onto a substrate having a seed layer includes placing the substrate into contact with an electrochemical plating bath containing cobalt or nickel, with the plating bath having pH of 4.0 to 9.0. Electric current is conducted through the bath to the substrate. The cobalt or nickel ions in the bath deposit onto the seed layer. The plating bath may contain cobalt chloride and glycine. The electric current may range from 1-50 milli-ampere per square cm. After completion of the electrochemical process, the substrate may be removed from the plating bath, rinsed and dried, and then annealed at a temperature of 200 to 400 C to improve the material properties and reduce seam line defects. The plating and anneal process may be performed through multiple cycles.

Abstract: A magnetic read/write head is produced with an insert layer between the substrate and the magnetic transducer. The insert layer has a lower coefficient of thermal expansion than the substrate, which reduces the temperature pole tip recession (T-PTR) of the head because the insert layer is an intervening layer between the substrate and magnetic transducer. The insert layer is produced by plating, e.g., an Invar layer over the substrate prior to fabricating the magnetic transducer. The Invar layer is annealed and the structure planarized prior to depositing a non-magnetic gap layer followed by the fabrication of the magnetic transducer.

Abstract: An electroplated film is deposited over a substrate with a plating frame pattern that includes a plating field defined by a plurality of individual features. By dividing the plating field into a plurality of individual features, the delamination force at any location on the plating field is greatly reduced. Thus, a film with a large stress, such as a high moment film, may be plated to a greater thickness than is possible with conventionally plated films.

Abstract: A magnetic read/write head is produced with an insert layer between the substrate and the magnetic transducer. The insert layer has a lower coefficient of thermal expansion than the substrate, which reduces the temperature pole tip recession (T-PTR) of the head because the insert layer is an intervening layer between the substrate and magnetic transducer. The insert layer is produced by plating, e.g., an Invar layer over the substrate prior to fabricating the magnetic transducer. The Invar layer is annealed and the structure planarized prior to depositing a non-magnetic gap layer followed by the fabrication of the magnetic transducer.