Patents by Inventor John W. Woods
John W. Woods has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240189673Abstract: A golf club head includes a crown surface having an apex at a highest point and extending between the face, the rear, the heel and the toe of the golf club head. The golf club head also includes a plurality of crown turbulators projecting from the surface of the crown and located between the face and the apex, wherein each adjacent pair of crown turbulators is separate and spaced apart to define a space between the adjacent pair of crown turbulators.Type: ApplicationFiled: February 20, 2024Publication date: June 13, 2024Inventors: Erik M. Henrikson, Paul D. Wood, John Hart, Marty R. Jertson, Ryan M. Stokke, Xiaojian Chen, Matthew W. Simone, Yujen Huang
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Patent number: 8383007Abstract: The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.Type: GrantFiled: May 13, 2010Date of Patent: February 26, 2013Assignee: Siemens Energy, Inc.Inventors: James D. B. Smith, Gary Stevens, John W. Wood
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Patent number: 8357433Abstract: Polymer brushes (50) in a resin that create phonon pathways therein. The polymer brushes themselves comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK. The polymer brushes are 10-25% by volume of the resin, and the polymer hairs can orient surrounding resin molecules to the polymer hairs alignment (55).Type: GrantFiled: June 30, 2008Date of Patent: January 22, 2013Assignee: Siemens Energy, Inc.Inventors: Gary C. Stevens, James D. B. Smith, John W. Wood
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Patent number: 8313832Abstract: The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.Type: GrantFiled: July 16, 2010Date of Patent: November 20, 2012Assignee: Siemens Energy, Inc.Inventors: James D Smith, Gary Stevens, John W Wood
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Patent number: 8277613Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.Type: GrantFiled: January 20, 2010Date of Patent: October 2, 2012Assignee: Siemens Energy, Inc.Inventors: James D. B. Smith, Gary Stevens, John W. Wood
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Publication number: 20120099652Abstract: A method and apparatus for scalable coding of a motion vector generated during motion estimation, in which a generated motion vector field is separated into a base layer and an enhancement layer according to pixel accuracies to obtain a layered structure for a motion vector. In addition, the motion vector field has a layered structure including a base layer composed of motion vectors of blocks larger than or equal to a predetermined size and at least one enhancement layer composed of motion vectors of blocks smaller than a predetermined size.Type: ApplicationFiled: December 28, 2011Publication date: April 26, 2012Applicant: Samsung Electronics Co., Ltd.Inventors: John W. WOODS, Yongjun Wu
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Patent number: 8107535Abstract: A method and apparatus for scalable coding of a motion vector generated during motion estimation, in which a generated motion vector field is separated into a base layer and an enhancement layer according to pixel accuracies to obtain a layered structure for a motion vector. In addition, the motion vector field has a layered structure including a base layer composed of motion vectors of blocks larger than or equal to a predetermined size and at least one enhancement layer composed of motion vectors of blocks smaller than a predetermined size.Type: GrantFiled: March 9, 2006Date of Patent: January 31, 2012Assignee: Rensselaer Polytechnic Institute (RPI)Inventors: John W. Woods, Yongjun Wu
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Publication number: 20120009408Abstract: The impregnation of a composite tape (56) having a porous matrix with HTC particles provides for permeating a fabric substrate layer (51) of the composite tape with HTC particles and impregnating an impregnating resin into the composite tape (51). The HTC particles in the fabric (51) layer are comprised of a meso-micro mixture, which is between 1:4 to 4:1 meso sized particles to micro sized particles. Other smaller particles may also be included at lesser concentrations. The impregnating resin itself may also contain HTC particles.Type: ApplicationFiled: September 19, 2011Publication date: January 12, 2012Inventors: GARY C. STEVENS, James D. B. Smith, John W. Wood, Andreas Lutz
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Patent number: 8030818Abstract: A stator coil includes a plurality of copper strands and a layer of high thermal conductivity polymer disposed adjacent at least one of the copper strands. The high thermal conductivity polymer includes a host polymer and a high thermal conductivity filler. The high thermal conductivity polymer improves heat transfer from the plurality copper strands.Type: GrantFiled: June 30, 2008Date of Patent: October 4, 2011Assignee: Siemens Energy, Inc.Inventors: Thomas I. Nelson, John W. Wood, Lon W. Montgomery
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Patent number: 7967938Abstract: The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.Type: GrantFiled: May 13, 2010Date of Patent: June 28, 2011Assignee: Siemens Energy, Inc.Inventors: James D Smith, Gary Stevens, John W Wood
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Patent number: 7955661Abstract: A method for the treatment of micro pores within a mica paper that includes: obtaining a silane with a molecular weight of between approximately 15 and 300, adding the silane to the mica paper, and reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores with the mica paper through the silane. In one embodiment, the mica paper is compressed by an amount between 5% and 30% of its original thickness. In another embodiment, the mica paper is compressed both prior to reacting the silane and during impregnation with the resin.Type: GrantFiled: January 23, 2007Date of Patent: June 7, 2011Assignee: Siemens Energy, Inc.Inventors: Gary Stevens, James D. B. Smith, John W. Wood
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Patent number: 7917760Abstract: Methods, apparati and computer-readable media for securely loading a software module over a communications network from a software provider (SP)(101) onto a tamper resistant module (TRM)(103).Type: GrantFiled: June 20, 2007Date of Patent: March 29, 2011Assignee: Multos LimitedInventors: Brian B. McKeon, John W. Wood, David Barrington Everett
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Patent number: 7851059Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.Type: GrantFiled: September 28, 2006Date of Patent: December 14, 2010Assignee: Siemens Energy, Inc.Inventors: Gary Stevens, James D. B. Smith, John W. Wood
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Patent number: 7846853Abstract: An electrical insulation paper that is made of mica flakelets (22), having an average size range of 0.01 to 0.05 mm in their thinnest dimension, hexagonal boron nitride (26), which has an average size range of 10 to 1,000 nm in their longest dimension, and a resin matrix. The mica flakelets and the hexagonal boron nitride are mixed and formed into a paper (17), and the resin is added to the paper after formation, the ratio by weight of the hexagonal boron nitride to the mica flakelets is directly proportional to the average size of the hexagonal boron nitride compared to the average size of the mica flakelets, within an adjustment factor.Type: GrantFiled: January 23, 2007Date of Patent: December 7, 2010Assignee: Siemens Energy, Inc.Inventors: Gary Stevens, James D. B. Smith, John W. Wood, Peter Groeppel
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Patent number: 7837817Abstract: The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.Type: GrantFiled: June 8, 2009Date of Patent: November 23, 2010Assignee: Siemens Energy, Inc.Inventors: James D Smith, Gary Stevens, John W Wood
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Publication number: 20100276628Abstract: The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.Type: ApplicationFiled: July 16, 2010Publication date: November 4, 2010Inventors: James D. Smith, Gary Stevens, John W. Wood
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Publication number: 20100239851Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.Type: ApplicationFiled: September 28, 2006Publication date: September 23, 2010Inventors: Gary Stevens, James D.B. Smith, John W. Wood
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Publication number: 20100213413Abstract: The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.Type: ApplicationFiled: May 13, 2010Publication date: August 26, 2010Inventors: James D. B. Smith, Gary Stevens, John W. Wood
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Publication number: 20100215861Abstract: The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.Type: ApplicationFiled: May 13, 2010Publication date: August 26, 2010Inventors: James D. Smith, Gary Stevens, John W. Wood
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Patent number: 7781057Abstract: The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.Type: GrantFiled: April 3, 2006Date of Patent: August 24, 2010Assignee: Siemens Energy, Inc.Inventors: James D. B. Smith, Gary Stevens, John W. Wood