Abstract: A method and apparatus for achieving etch rate uniformity in a reactive ion etcher. The reactive ion etcher generates a plasma within a vacuum chamber for etching a substrate disposed at a cathode of a reactor can within the chamber wherein the plasma emanates from a top plate of the reactor can, and is influenced by localized magnetic fields for locally controlling etch rates across the cathode to produce a uniform etch rate distribution across the cathode as a result of the localized magnetic field. The magnet array may be disposed between the top plate and the vacuum chamber for providing the localized magnetic fields. The magnet array includes a plurality of individual magnets and a grid plate for holding the individual magnets in position.

Abstract: A can for use in an etching system including a continuous conductive wall with a first opening to be placed adjacent the reactor upper electrode and a second opening to be placed adjacent the reactor lower electrode. Preferably, the conductive wall is a dual wall further including an inner wall and an outer wall, the inner and outer wall separated by one or more openings configured normal to the height of the continuous wall, the openings allowing for the flow of coolant through the wall.

Abstract: Protection against certain aquatic pests can be obtained by use of certain alkyl tin dithiocarbamates in the coating for materials exposed to such pests or the aquatic enivornment in contact with these materials.