Patents by Inventor John William Ertel

John William Ertel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for testing a component
    Patent number: 8013599
    Abstract: A method for inspecting a component having a surface profile that includes a local minima and a local maxima. The method includes positioning an eddy current probe proximate to a surface of the component to generate a first position indication, positioning the eddy current probe proximate to the surface of the component to generate a second position indication that is different than the first position indication, and interpolating between the first and second position indications to determine a profile of a portion of the surface of the component.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: September 6, 2011
    Assignee: General Electric Company
    Inventors: Ui Won Suh, Gigi Olive Gambrell, John William Ertel, William Stewart McKnight
  • Methods and apparatus for testing a component
    Patent number: 7436992
    Abstract: A method for inspecting a component. The method includes generating a scan plan of a component to be inspected, coupling a side-mount probe to an eddy current inspection system, inducing an eddy current into the component, measuring the eddy current in the component to generate a plurality of scan data, and analyzing the scan data to generate at least one image of the component being inspected.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: October 14, 2008
    Assignee: General Electric Company
    Inventors: Ui Won Suh, Gigi Olive Gambrell, John William Ertel, William Stewart McKnight
  • Molded eddy current array probe
    Patent number: 6812697
    Abstract: The present invention provides an eddy current array probe having a complaint body molded around a rigid insert. A flexible eddy current array circuit is wrapped around the outer surface of the compliant body.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: November 2, 2004
    Assignee: General Electric Company
    Inventors: William Stewart McKnight, Shridhar Champaknath Nath, Sandie Elizabeth Gresham, Richard Lloyd Trantow, Douglas Edward Ingram, John William Ertel, Thomas James Batzinger, Curtis Wayne Rose, Francis Howard Little
  • Molded eddy current array probe
    Publication number: 20040056656
    Abstract: The present invention provides an eddy current array probe having a complaint body molded around a rigid insert. A flexible eddy current array circuit is wrapped around the outer surface of the compliant body.
    Type: Application
    Filed: September 24, 2002
    Publication date: March 25, 2004
    Applicant: General Electric Company
    Inventors: William Stewart McKnight, Shridhar Champaknath Nath, Sandie Elizabeth Gresham, Richard Lloyd Trantow, Douglas Edward Ingram, John William Ertel, Thomas James Batzinger, Curtis Wayne Rose, Francis Howard Little