Patents by Inventor Jon Bradley Lasiter
Jon Bradley Lasiter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10734332Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.Type: GrantFiled: December 12, 2017Date of Patent: August 4, 2020Assignee: QUALCOMM IncorporatedInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Vladimir Aparin, Seong Heon Jeong, Jeremy Dunworth, Alireza Mohammadian, Mario Francisco Velez, Chin-Kwan Kim
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Patent number: 10685924Abstract: An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.Type: GrantFiled: August 24, 2017Date of Patent: June 16, 2020Assignee: QUALCOMM IncorporatedInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Mario Francisco Velez
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Patent number: 10618079Abstract: An apparatus may include one or more segmented piezoelectric micromechanical ultrasonic transducer (PMUT) elements. Each segmented PMUT element may include a substrate, an anchor structure disposed on the substrate and a membrane disposed proximate the anchor structure. The membrane may include a piezoelectric layer stack and a mechanical layer. The anchor structure may include boundary portions that divide the segmented PMUT element into segments. Each segment may have a corresponding segment cavity. The boundary portions may correspond to nodal lines of the entire membrane. The membrane may include a membrane segment disposed proximate each segment cavity. The membrane may be configured to undergo one or both of flexural motion and vibration when the segmented PMUT element receives or transmits signals.Type: GrantFiled: February 23, 2017Date of Patent: April 14, 2020Assignee: QUALCOMM IncorporatedInventors: Donald William Kidwell, Jr., Ravindra Vaman Shenoy, Jon Bradley Lasiter
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Patent number: 10497748Abstract: An ultrasonic sensor pixel includes a substrate, a piezoelectric micromechanical ultrasonic transducer (PMUT) and a sensor pixel circuit. The PMUT includes a piezoelectric layer stack including a piezoelectric layer disposed over a cavity, the cavity being disposed between the piezoelectric layer stack and the substrate, a reference electrode disposed between the piezoelectric layer and the cavity, and one or both of a receive electrode and a transmit electrode disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The sensor pixel circuit is electrically coupled with one or more of the reference electrode, the receive electrode and the transmit electrode and the PMUT and the sensor pixel circuit are integrated with the sensor pixel circuit on the substrate.Type: GrantFiled: October 12, 2016Date of Patent: December 3, 2019Assignee: QUALCOMM IncorporatedInventors: Hrishikesh Vijaykumar Panchawagh, Suryaprakash Ganti, Kostadin Dimitrov Djordjev, David William Burns, Timothy Alan Dickinson, Donald William Kidwell, Jr., Ravindra Vaman Shenoy, Jon Bradley Lasiter, Hao-Yen Tang, Yipeng Lu
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Patent number: 10490880Abstract: The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-based antenna array package includes a single glass substrate layer, one or more antennas attached to a first side of the glass substrate layer, at least one semiconductor device attached to a second side of the glass substrate layer, and a first photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device. A method of manufacturing the same is also disclosed.Type: GrantFiled: September 18, 2017Date of Patent: November 26, 2019Assignee: QUALCOMM IncorporationInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Donald William Kidwell, Jr., Mohammad Ali Tassoudji, Mario Francisco Velez
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Patent number: 10478858Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a multilayer stack disposed on a substrate. The multilayer stack may include an anchor structure disposed over the substrate, a piezoelectric layer stack disposed over the anchor structure, and a mechanical layer disposed proximate to the piezoelectric layer stack. The piezoelectric layer stack may be disposed over a cavity. The mechanical layer may seal the cavity and, together with the piezoelectric layer stack, is supported by the anchor structure and forms a membrane over the cavity, the membrane being configured to undergo one or both of flexural motion and vibration when the PMUT receives or transmits ultrasonic signals.Type: GrantFiled: December 12, 2014Date of Patent: November 19, 2019Assignee: QUALCOMM IncorporatedInventors: Jon Bradley Lasiter, Ravindra Vaman Shenoy, Evgeni Petrovich Gousev, Hrishikesh Panchawagh, David William Burns, Nai-Kuei Kuo, Jonathan Charles Griffiths, Suryaprakash Ganti
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Publication number: 20190067219Abstract: An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.Type: ApplicationFiled: August 24, 2017Publication date: February 28, 2019Inventors: Jon Bradley LASITER, Ravindra Vaman SHENOY, Donald William KIDWELL, JR., Mohammad TASSOUDJI, Mario Francisco VELEZ
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Publication number: 20190067221Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.Type: ApplicationFiled: December 12, 2017Publication date: February 28, 2019Inventors: Jon Bradley LASITER, Ravindra Vaman SHENOY, Donald William KIDWELL, JR., Mohammad Ali TASSOUDJI, Vladimir APARIN, Seong Heon JEONG, Jeremy DUNWORTH, Alireza MOHAMMADIAN, Mario Francisco VELEZ, Chin-Kwan KIM
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Patent number: 10199152Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.Type: GrantFiled: June 18, 2015Date of Patent: February 5, 2019Assignee: QUALCOMM IncorporatedInventors: Mete Erturk, Ravindra Vaman Shenoy, Kwan-yu Lai, Jitae Kim, Donald William Kidwell, Jr., Jon Bradley Lasiter, James Thomas Doyle, Omar James Bchir
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Publication number: 20180342788Abstract: The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-based antenna array package includes a single glass substrate layer, one or more antennas attached to a first side of the glass substrate layer, at least one semiconductor device attached to a second side of the glass substrate layer, and a first photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device. A method of manufacturing the same is also disclosed.Type: ApplicationFiled: September 18, 2017Publication date: November 29, 2018Inventors: Jon Bradley LASITER, Ravindra Vaman SHENOY, Donald William KIDWELL, JR., Mohammad Ali TASSOUDJI, Mario Francisco VELEZ
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Patent number: 10001552Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a diaphragm disposed over a cavity, the diaphragm including a piezoelectric layer stack including a piezoelectric layer, a first electrode electrically coupled with transceiver circuitry, and a second electrode electrically coupled with the transceiver circuitry. The first electrode may be disposed in a first portion of the diaphragm, and the second electrode may be disposed in a second, separate, portion of the diaphragm. Each of the first and the second electrode is disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The PMUT is configured to transmit first ultrasonic signals by way of the first electrode during a first time period and to receive second ultrasonic signals by way of the second electrode during a second time period, the first time period and the second time period being at least partially overlapping.Type: GrantFiled: October 14, 2015Date of Patent: June 19, 2018Assignee: QUALCOMM IncorporatedInventors: Hrishikesh Vijaykumar Panchawagh, Hao-Yen Tang, Yipeng Lu, Kostadin Dimitrov Djordjev, Suryaprakash Ganti, David William Burns, Ravindra Vaman Shenoy, Jon Bradley Lasiter, Nai-Kuei Kuo, Firas Sammoura
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Patent number: 9773862Abstract: Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.Type: GrantFiled: December 11, 2016Date of Patent: September 26, 2017Assignee: QUALCOMM IncorporatedInventors: Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Donald William Kidwell, Jr., Jon Bradley Lasiter, Kwan-Yu Lai, Jitae Kim, Ravindra Vaman Shenoy
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Publication number: 20170246662Abstract: An apparatus may include one or more segmented piezoelectric micromechanical ultrasonic transducer (PMUT) elements. Each segmented PMUT element may include a substrate, an anchor structure disposed on the substrate and a membrane disposed proximate the anchor structure. The membrane may include a piezoelectric layer stack and a mechanical layer. The anchor structure may include boundary portions that divide the segmented PMUT element into segments. Each segment may have a corresponding segment cavity. The boundary portions may correspond to nodal lines of the entire membrane. The membrane may include a membrane segment disposed proximate each segment cavity. The membrane may be configured to undergo one or both of flexural motion and vibration when the segmented PMUT element receives or transmits signals.Type: ApplicationFiled: February 23, 2017Publication date: August 31, 2017Inventors: Donald William Kidwell, JR., Ravindra Vaman Shenoy, Jon Bradley Lasiter
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Publication number: 20170125512Abstract: Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.Type: ApplicationFiled: December 11, 2016Publication date: May 4, 2017Inventors: Changhan Hobie YUN, Daeik Daniel KIM, Chengjie ZUO, Jonghae KIM, Mario Francisco VELEZ, Donald William KIDWELL JR, Jon Bradley LASITER, Kwan-Yu LAI, Jitae KIM, Ravindra Vaman SHENOY
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Publication number: 20170110504Abstract: An ultrasonic sensor pixel includes a substrate, a piezoelectric micromechanical ultrasonic transducer (PMUT) and a sensor pixel circuit. The PMUT includes a piezoelectric layer stack including a piezoelectric layer disposed over a cavity, the cavity being disposed between the piezoelectric layer stack and the substrate, a reference electrode disposed between the piezoelectric layer and the cavity, and one or both of a receive electrode and a transmit electrode disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The sensor pixel circuit is electrically coupled with one or more of the reference electrode, the receive electrode and the transmit electrode and the PMUT and the sensor pixel circuit are integrated with the sensor pixel circuit on the substrate.Type: ApplicationFiled: October 12, 2016Publication date: April 20, 2017Inventors: Hrishikesh Vijaykumar Panchawagh, Suryaprakash Ganti, Kostadin Dimitrov Djordjev, David William Burns, Timothy Alan Dickinson, Donald William Kidwell, JR., Ravindra Vaman Shenoy, Jon Bradley Lasiter, Hao-Yen Tang, Yipeng Lu
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Patent number: 9548350Abstract: Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.Type: GrantFiled: February 10, 2014Date of Patent: January 17, 2017Assignee: QUALCOMM IncorporatedInventors: Changhan Hobie Yun, Daeik Daniel Kim, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Donald William Kidwell, Jr., Jon Bradley Lasiter, Kwan-Yu Lai, Jitae Kim, Ravindra Vaman Shenoy
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Patent number: 9510454Abstract: An integrated interposer between a first component and a second component includes a substrate. The substrate may have thermal and/or mechanical properties with values lying between the thermal and/or mechanical properties of the first component and the second component. Active devices are disposed on a first surface of the substrate. A contact layer is coupled to the active devices and configured to couple at least the first component and a third component to the integrated interposer. At least one through via(s) is coupled to the contact layer and extends through the substrate to a second surface of the substrate. An interconnect layer is disposed on the second surface of the substrate and coupled to the at least one through via(s). The interconnect layer is configured to couple the second component to the integrated interposer.Type: GrantFiled: August 19, 2014Date of Patent: November 29, 2016Assignee: QUALCOMM INCORPORATEDInventors: Vidhya Ramachandran, Urmi Ray, Ravindra Vaman Shenoy, Kwan-Yu Lai, Jon Bradley Lasiter
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Publication number: 20160163443Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.Type: ApplicationFiled: June 18, 2015Publication date: June 9, 2016Inventors: Mete ERTURK, Ravindra Vaman SHENOY, Kwan-yu LAI, Jitae KIM, Donald William KIDWELL JR., Jon Bradley LASITER, James Thomas DOYLE, Omar James BCHIR
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Patent number: 9325420Abstract: An apparatus includes a substrate and a waveguide coupled to a surface of the substrate. The surface forms a cladding layer of the waveguide. The apparatus includes a photodetector optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal.Type: GrantFiled: May 16, 2014Date of Patent: April 26, 2016Assignee: QUALCOMM IncorporatedInventors: Kwan-yu Lai, Ravindra Vaman Shenoy, Jitae Kim, Jon Bradley Lasiter, Donald William Kidwell, Jr., Evgeni Petrovich Gousev
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Publication number: 20160107194Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a diaphragm disposed over a cavity, the diaphragm including a piezoelectric layer stack including a piezoelectric layer, a first electrode electrically coupled with transceiver circuitry, and a second electrode electrically coupled with the transceiver circuitry. The first electrode may be disposed in a first portion of the diaphragm, and the second electrode may be disposed in a second, separate, portion of the diaphragm. Each of the first and the second electrode is disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The PMUT is configured to transmit first ultrasonic signals by way of the first electrode during a first time period and to receive second ultrasonic signals by way of the second electrode during a second time period, the first time period and the second time period being at least partially overlapping.Type: ApplicationFiled: October 14, 2015Publication date: April 21, 2016Inventors: Hrishikesh Vijaykumar Panchawagh, Hao-Yen Tang, Yipeng Lu, Kostadin Dimitrov Djordjev, Suryaprakash Ganti, David William Burns, Ravindra Vaman Shenoy, Jon Bradley Lasiter, Nai-Kuei Kuo, Firas Sammoura