Patents by Inventor Jon Brunner

Jon Brunner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7795557
    Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: September 14, 2010
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Jon Brunner, Horst Clauberg, John Shuhart
  • Publication number: 20080264907
    Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.
    Type: Application
    Filed: May 2, 2008
    Publication date: October 30, 2008
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Jon Brunner, Horst Clauberg, John Shuhart
  • Publication number: 20080210740
    Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.
    Type: Application
    Filed: August 15, 2007
    Publication date: September 4, 2008
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: James E. Eder, Jon Brunner
  • Patent number: 7411157
    Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: August 12, 2008
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Jon Brunner, Horst Clauberg, John Shuhart
  • Patent number: 7320425
    Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: January 22, 2008
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: James E. Eder, Jon Brunner
  • Publication number: 20060186179
    Abstract: A wire bonder and a method of bonding a bonding wire to a bonding pad of a bonding location using the wire bonder are provided. The method includes forming a bonding ball at an end of the bonding wire, pre-deforming at least a portion of the bonding ball and bonding the pre-deformed ball to the bonding pad. The wire bonder includes a source of heat disposed adjacent a bonding tool to melt a portion of the bonding wire to produce the bonding ball at an end thereof, and a pre-deforming unit including a deforming surface to pre-deform at least a portion of the bonding ball.
    Type: Application
    Filed: February 23, 2005
    Publication date: August 24, 2006
    Inventors: Lee Levine, Matthew Osborne, Stephen Babinetz, Jon Brunner
  • Publication number: 20060076337
    Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.
    Type: Application
    Filed: February 8, 2005
    Publication date: April 13, 2006
    Inventors: Jon Brunner, Horst Clauberg, John Shuhart
  • Patent number: 7004369
    Abstract: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: February 28, 2006
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Gil Perlberg, Arie Bahalul, Dan Mironescu, Moshe Amsalem, Jon Brunner
  • Publication number: 20050252950
    Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.
    Type: Application
    Filed: May 5, 2005
    Publication date: November 17, 2005
    Inventors: James Eder, Jon Brunner
  • Patent number: 6910612
    Abstract: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: June 28, 2005
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Gil Perlberg, Arie Bahalul, Dan Mironescu, Moshe Amsalem, Jon Brunner
  • Publication number: 20050121494
    Abstract: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.
    Type: Application
    Filed: January 18, 2005
    Publication date: June 9, 2005
    Inventors: Gil Perlberg, Arie Bahalul, Dan Mironescu, Moshe Amsalem, Jon Brunner
  • Publication number: 20040094606
    Abstract: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed in the bonding tool.
    Type: Application
    Filed: August 12, 2003
    Publication date: May 20, 2004
    Inventors: Gil Perlberg, Arie Bahalul, Dan Mironescu, Moshe Amsalem, Jon Brunner