Patents by Inventor Jon Filreis
Jon Filreis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9368854Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.Type: GrantFiled: November 26, 2013Date of Patent: June 14, 2016Assignee: ViaSat, Inc.Inventors: Noel A. Lopez, Charles E. Woods, Rob Zienkewicz, Jon Filreis
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Publication number: 20140152397Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.Type: ApplicationFiled: November 26, 2013Publication date: June 5, 2014Applicant: ViaSat, Inc.Inventors: Noel A. Lopez, Charles E. Woods, Rob Zienkewicz, Jon Filreis
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Patent number: 8598966Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.Type: GrantFiled: May 15, 2012Date of Patent: December 3, 2013Assignee: ViaSat, Inc.Inventors: Noel Lopez, Charles Woods, Rob Zienkewicz, Jon Filreis
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Publication number: 20120229219Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.Type: ApplicationFiled: May 15, 2012Publication date: September 13, 2012Applicant: VIASAT, INC.Inventors: Noel Lopez, Charles Woods, Rob Zienkewicz, Jon Filreis
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Patent number: 8212631Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.Type: GrantFiled: March 12, 2009Date of Patent: July 3, 2012Assignee: ViaSat, Inc.Inventors: Noel Lopez, Charles Woods, Rob Zienkewicz, Jon Filreis
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Patent number: 7782156Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.Type: GrantFiled: September 11, 2007Date of Patent: August 24, 2010Assignee: ViaSat, Inc.Inventors: Charles Woods, Noel Lopez, Dean Cook, Jon Filreis
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Publication number: 20090231055Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.Type: ApplicationFiled: March 12, 2009Publication date: September 17, 2009Applicant: VIASAT, INC.Inventors: Noel Lopez, Charles Woods, Rob Zienkewicz, Jon Filreis
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Publication number: 20090066441Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.Type: ApplicationFiled: September 11, 2007Publication date: March 12, 2009Applicant: VIASAT, INC.Inventors: Charles Woods, Noel Lopez, Dean Cook, Jon Filreis
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Patent number: 7157793Abstract: Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconductor substrate. Therefore, direct thermal cooling may be employed to reduce the thermal spreading resistance often encountered in MMIC power amplifier devices. Furthermore, exemplary methods to achieve this sealing are described herein.Type: GrantFiled: May 19, 2004Date of Patent: January 2, 2007Assignee: U.S. Monolithics, L.L.C.Inventors: Richard S. Torkington, Jon Filreis, Kenneth V. Buer
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Publication number: 20050098880Abstract: Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconductor substrate. Therefore, direct thermal cooling may be employed to reduce the thermal spreading resistance often encountered in MMIC power amplifier devices. Furthermore, exemplary methods to achieve this sealing are described herein.Type: ApplicationFiled: May 19, 2004Publication date: May 12, 2005Inventors: Richard Torkington, Jon Filreis, Kenneth Buer