Patents by Inventor Jon H. Pack

Jon H. Pack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal processing apparatus
    Patent number: 6005225
    Abstract: A vertical rapid heating furnace for treating semiconductor wafers comprising a hot wall reaction tube positioned within a cylindrical array of circular parallel heating elements substantially concentric therewith, each heating element being spaced from the hot wall reaction tube, each heating element comprising a coil of resistance heating conductor. The coiled resistance heating conductor can be a coil of resistance heating wire, the coil having an outer diameter of from 1 to 7 mm and supported in an annular heating element support. Each heating element support is dimensioned to support and accommodate the thermally expanded heating element supported therein at both the minimum and maximum furnace temperatures. Preferably, each annular heating element support is provided by an annular recess in the insulation surrounding the array of heating elements.
    Type: Grant
    Filed: March 28, 1997
    Date of Patent: December 21, 1999
    Assignee: Silicon Valley Group, Inc.
    Inventors: Jeffrey M. Kowalski, Christopher T. Ratliff, Terry A. Koble, Jr., Jon H. Pack, Michael H. Yang