Patents by Inventor Jon Huppenthal

Jon Huppenthal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210303315
    Abstract: A system includes an application plane having a reconfigurable logic device defining application logic, a data input plane defining a first port operable to receive application data for processing on the application logic and a management plane defining a second port separate from the first port and operable to reconfigure the application logic
    Type: Application
    Filed: March 30, 2021
    Publication date: September 30, 2021
    Inventors: Todd Rooke, Jon Huppenthal, Timothy P. Wilkinson
  • Publication number: 20210303723
    Abstract: According to various embodiments disclosed herein, methods and systems for managing security vulnerabilities of a heterogeneous computing platform utilizing a microprocessor are disclosed. Specifically, methods and systems for managing attack surfaces of an instruction set architecture co-processor in communication with an FPGA control module are disclosed.
    Type: Application
    Filed: March 30, 2021
    Publication date: September 30, 2021
    Inventors: Todd Rooke, Jon Huppenthal, Timothy P. Wilkinson
  • Publication number: 20070204131
    Abstract: Multi-adaptive processing systems and techniques for enhancing parallelism and performance of computational functions are disclosed which can be employed in a myriad of applications including multi-dimensional pipeline computations for seismic applications, search algorithms, information security, chemical and biological applications, filtering and the like as well as for systolic wavefront computations for fluid flow and structures analysis, bioinformatics etc. Some applications may also employ both the multi-dimensional pipeline and systolic wavefront methodologies disclosed.
    Type: Application
    Filed: April 9, 2007
    Publication date: August 30, 2007
    Applicant: SRC COMPUTERS, INC.
    Inventors: Jon Huppenthal, David Caliga
  • Publication number: 20060195729
    Abstract: A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.
    Type: Application
    Filed: May 12, 2006
    Publication date: August 31, 2006
    Applicant: Arbor Company LLP
    Inventors: Jon Huppenthal, D. James Guzy
  • Publication number: 20060136606
    Abstract: A logic device comprising reconfigurable core logic for use in conjunction with microprocessor-based computer systems which may be implemented as fully reconfigurable circuitry or a combination of reconfigurable logic and fixed logic sections. The core logic may contain parameterized functions that are selectable dynamically or during a manufacturing process and can allow for the dynamic, or predetermined, reallocation of external bandwidth between two or more ports. The fully reconfigurable circuitry, or a combination of reconfigurable and fixed logic, may be co-fabricated on a single die or formed by integrated circuit die stacking techniques. At least portions of the reconfigurable logic circuitry may be configured to function as one or more direct execution logic (DEL) reconfigurable processing elements that may function as effective peers with the associated microprocessor(s) in terms of accessing computing system resources.
    Type: Application
    Filed: November 19, 2004
    Publication date: June 22, 2006
    Inventors: D. Guzy, Lee Burton, Jon Huppenthal
  • Publication number: 20060012395
    Abstract: A reconfigurable processor element incorporating both course and fine grained reconfigurable elements. In alternative implementations, the present invention may comprise a reconfigurable processor comprising both reconfigurable devices with fine grained logic elements and reconfigurable devices with course grained logic elements or a reconfigurable processor comprising both reconfigurable devices with fine grained elements and non-reconfigurable devices with course grained elements.
    Type: Application
    Filed: September 8, 2005
    Publication date: January 19, 2006
    Inventors: Jon Huppenthal, Denis Kellam
  • Publication number: 20050283546
    Abstract: A switch/network adapter port (“SNAP™”) in a dual in-line memory module (“DIMM”) or Rambus™ in-line memory module (“RIMM”) format for clustered computers employing multi-adaptive processor (“MAP®”, both trademarks of SRC Computers, Inc.) elements for use with interleaved memory controllers. Particularly disclosed is a microprocessor based computer system utilizing either a DIMM or RIMM physical format adapter port coupled to a reconfigurable processor element for the purpose of implementing a connection to an external switch, network, or other device. In a particular embodiment, connections may be provided to either the PCI, accelerated graphics port (“AGP”) or system maintenance (“SM”) bus for purposes of passing control information to the host microprocessor or other control chips. The field programmable gate array (“FPGA”) based processing elements have the capability to alter data passing through it to and from an external interconnect fabric or device.
    Type: Application
    Filed: August 15, 2005
    Publication date: December 22, 2005
    Inventors: Jon Huppenthal, Thomas Seeman, Lee Burton
  • Publication number: 20050257029
    Abstract: A multi-adaptive processor element architecture incorporating a field programmable gate array (“FPGA”) control element having at least one embedded processor core and a pair of user FPGAs forming a user array is disclosed in conjunction with high volume dynamic random access memory (“DRAM”) and dual-ported static random access memory (“SRAM”) banks. In operation, the DRAM is “read” using its fast sequential burst modes and the lower capacity SRAM banks are then randomly loaded allowing the user FPGAs to experience very high random access data rates from what appears to be a very large virtual SRAM. The reverse also happens when the user FPGAs are “writing” data to the SRAM banks. These overall control functions may be managed by an on-chip DMA engine that is implemented in the control FPGA.
    Type: Application
    Filed: May 2, 2005
    Publication date: November 17, 2005
    Applicant: SRC Computers,Inc.
    Inventors: Jon Huppenthal, Denis Kellam
  • Publication number: 20050091434
    Abstract: A switch/network adapter port (“SNAP”) for clustered computers employing multi-adaptive processor (“MAP™”, a trademark of SRC Computers, Inc.) elements in a dual in-line memory module (“DIMM”) or Rambus™ in-line memory module (“RIMM”) format to significantly enhance data transfer rates over that otherwise available through use of the standard peripheral component interconnect (“PCI”) bus. Particularly disclosed is a microprocessor based computer system utilizing either a DIMM or RIMM physical format processor element for the purpose of implementing a connection to an external switch, network, or other device. In a particular embodiment, connections may be provided to either the PCI, accelerated graphics port (“AGP”) or system maintenance (“SM”) bus for purposes of passing control information to the host microprocessor or other control chips.
    Type: Application
    Filed: November 23, 2004
    Publication date: April 28, 2005
    Inventors: Jon Huppenthal, Thomas Seeman, Lee Burton
  • Publication number: 20050076152
    Abstract: A switch/network adapter port (“SNAP™”) in a dual in-line memory module (“DIMM”) or Rambus™ in-line memory module (“RIMM”) format for clustered computers employing multi-adaptive processor (“MAP® ”, both trademarks of SRC Computers, Inc.) elements for use with interleaved memory controllers. Particularly disclosed is a microprocessor based computer system utilizing either a DIMM or RIMM physical format adapter port coupled to a reconfigurable processor element for the purpose of implementing a connection to an external switch, network, or other device. In a particular embodiment, connections may be provided to either the PCI, accelerated graphics port (“AGP”) or system maintenance (“SM”) bus for purposes of passing control information to the host microprocessor or other control chips. The field programmable gate array (“FPGA”) based processing elements have the capability to alter data passing through it to and from an external interconnect fabric or device.
    Type: Application
    Filed: January 10, 2003
    Publication date: April 7, 2005
    Inventors: Jon Huppenthal, Thomas Seeman, Lee Burton
  • Publication number: 20050055537
    Abstract: A multiprocessor computer architecture incorporating a plurality of programmable hardware memory algorithm processors (“MAP”) in the memory subsystem. The MAP may comprise one or more field programmable gate arrays (“FPGAs”) which function to perform identified algorithms in conjunction with, and tightly coupled to, a microprocessor and each MAP is globally accessible by all of the system processors for the purpose of executing user definable algorithms. A circuit within the MAP signals when the last operand has completed its flow thereby allowing a given process to be interrupted and thereafter restarted. Through the use of read only memory (“ROM”) located adjacent the FPGA, a user program may use a single command to select one of several possible pre-loaded algorithms thereby decreasing system reconfiguration time.
    Type: Application
    Filed: October 20, 2004
    Publication date: March 10, 2005
    Inventors: Jon Huppenthal, Paul Leskar
  • Patent number: 5162728
    Abstract: A digital test system for functionally testing undiced ICs on wafers at relatively high test frequencies includes an improved probe card and interface assemblies. The probe card and interface assemblies each include a plurality of printed circuit boards laminated together as a single laminated structure. Equal length and equal impedance elongated micro strip test signal traces conduct the signals to and from a probe ring with a plurality of resilient probes physically and electrically in contact with the contact pads of the IC. Other circuit patterns includes a relatively large reference plane and a power plane of approximately equal size. The interface assembly performs selective I/O functions to electrically conduct input signals from a test signal generator to the probe card assembly and to electrically conduct response signals from the probe card assembly to the signal analyzer for determining the proper functionality of the IC.
    Type: Grant
    Filed: September 11, 1990
    Date of Patent: November 10, 1992
    Assignee: Cray Computer Corporation
    Inventor: Jon Huppenthal