Abstract: A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

Abstract: A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

Abstract: A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

Abstract: A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

Abstract: An optical device may include a modulator. The modulator may receive an optical signal. The modulator may modulate the optical signal to include a first channel and a second channel. The modulator may modulate the optical signal based on a training pattern associated with detecting a skew. The modulator may cause the first channel to interfere with the second channel. The modulator may perform a power measurement on the first channel and the second channel. The modulator may determine the skew based on the power measurement and the training pattern. The modulator may time delay the first channel or the second channel to align the skew based on the skew.

Abstract: Various embodiments of methods and systems for optimizing processing performance in a multi-functional portable computing device (“PCD”) are disclosed. Depending on how the PCD is being used, the temperature limit associated with the touch temperature of the PCD may be variable. As such, a preset and fixed touch temperature limit based on a “worst use case” scenario can unnecessarily limit the quality of service (“QoS”) provided to a user under different use case scenarios. Accordingly, embodiments of the systems and methods define and recognize different device definitions for the PCD which are each associated with certain use cases and each dictate different temperature thresholds or limits subject to which the PCD may run.

Abstract: Certain aspects of the present disclosure relate to a technique for touch temperature management of a wireless communications device based on power dissipated over time, and possibly internal temperature readings. For example, the information about power dissipated over time can be utilized along with monitored internal temperatures of a device's internal circuitry to reduce transmit power and/or data rates as required in order to keep a surface temperature of the wireless device below a specified limit. A knowledge of how the device's touch temperature varies with the dissipated power and a knowledge of the power dissipation history can be utilized to determine when to reduce the transmit power in order to avoid overheating (e.g., exceeding the touch temperature limit).

Abstract: Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (“PoP”) memory temperatures and the “touch temperature” of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.

Abstract: Various embodiments of methods and systems for thermally aware booting in a portable computing device (“PCD”) are disclosed. Because bringing high power consumption processing components online when a PCD is booted under less than ideal thermal conditions can be detrimental to the health of the PCD, embodiments leverage a low power processing component early in a boot sequence to authorize, delay or modify the boot sequence based on measured thermal indicators. One exemplary method is essentially a “go/no go” method that delays or authorizes completion of a boot sequence based on the thermal indicator measurements. Another exemplary method modifies a boot sequence of a PCD based on a thermal boot policy associated with a thermal boot state. A thermal boot policy may include allowing the boot sequence to complete by modifying the power frequency to which one or more high power consumption components will be booted.

Abstract: An optical device may include a modulator. The modulator may receive an optical signal. The modulator may modulate the optical signal to include a first channel and a second channel. The modulator may modulate the optical signal based on a training pattern associated with detecting a skew. The modulator may cause the first channel to interfere with the second channel. The modulator may perform a power measurement on the first channel and the second channel. The modulator may determine the skew based on the power measurement and the training pattern. The modulator may time delay the first channel or the second channel to align the skew based on the skew.

Abstract: An electrical current (“EC”) manager module may assign a plurality of hardware elements of the PCD to one of two groups. The EC manager module may monitor individual electrical current levels of one of the groups as well as calculate an instantaneous electrical current level for the PCD based on a current charge status for the PCD. The EC manager module may then adjust operation of at least one hardware element to keep operation of the PCD below the calculated instantaneous electrical current level for the PCD. The EC manager module may estimate an electrical current level for one of the groups based on requests issued to hardware elements. The EC manager module may also compare the calculated instantaneous electrical current level to the monitored electrical current level. The calculated instantaneous electrical current level may be compared to minimum current levels listed in a table.

Abstract: Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (“PoP”) memory temperatures and the “touch temperature” of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.

Abstract: Methods, systems, and devices for providing cooling for a mobile device using piezoelectric active cooling devices. Some embodiments utilize piezoelectric actuators that oscillate a planar element within an air channel to fan air within or at an outlet of the air channel. The air channel may be defined by at least one heat dissipation surface in thermal contact with components of the mobile device that generate excess waste heat. For example, the air channel may include a surface that is in thermal contact with a processor of the mobile computing device. In embodiments, the piezoelectric active cooling device may be used in an air gap between stacked packages in a package on package (PoP) processor package. The described embodiments provide active cooling using low power, can be controlled to provide variable cooling, use highly reliable elements, and can be implemented at low cost.

Abstract: Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (“PoP”) memory temperatures and the “touch temperature” of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.

Abstract: A technique for uplink data throttling includes buffer status report (BSR) scaling. A target data flow rate may be determined based on at least on condition of a wireless device. The buffer status report may be adjusted to cause the target flow rate and transmitted by the wireless device. The wireless device may then receive a flow control command based on the buffer status report.

Abstract: Certain aspects of the present disclosure relate to wireless communications and methods and apparatus for downlink flow control at a user equipment (UE). Aspects generally include monitoring, by a UE, one or more parameters related to the UE, and selectively dropping received packets based on the one or more parameters in order to trigger a rate control mechanism. Selectively dropping received packets may occur at a Packet Data Convergence Protocol (PDCP) layer in order to reduce a corresponding transmission control protocol (TCP) throughput. Accordingly, packets may be selectively dropped prior to reaching an applications processor.

Abstract: Various methods and systems for minimum supply voltage level selection in a portable computing device (“PCD”) are disclosed. It is an advantage of the various embodiments that PCD designers may close timing at a certain minimum supply voltage and operating temperature threshold that is higher than the lowest end of the main operating temperature range within which the PCD must function. By closing timing at the higher operating temperature threshold, relatively smaller components requiring relatively lower power consumption may be used in the PCD, thereby providing improved overall power consumption when the PCD is operating at operating temperatures above the threshold. To maintain functionality when operating temperatures fall below the threshold, the minimum supply voltage to the components is increased.

Abstract: Various embodiments of methods and systems for optimizing processing performance in a multi-functional portable computing device (“PCD”) are disclosed. Depending on how the PCD is being used, the temperature limit associated with the touch temperature of the PCD may be variable. As such, a preset and fixed touch temperature limit based on a “worst use case” scenario can unnecessarily limit the quality of service (“QoS”) provided to a user under different use case scenarios. Accordingly, embodiments of the systems and methods define and recognize different device definitions for the PCD which are each associated with certain use cases and each dictate different temperature thresholds or limits subject to which the PCD may run.

Abstract: Methods and systems for managing thermal load distribution on a portable computing device (“PCD”) include storing on a PCD a plurality of thermal load steering scenarios which identify simulated thermal load conditions for the PCD, corresponding simulated workloads that produced the simulated thermal load conditions, and thermal load steering parameters for steering the simulated thermal load to a predetermined spatial location on the PCD. A scheduled workload for the PCD is monitored to identify a match with one of the thermal load steering scenarios so that the workload may be scheduled according to a thermal load steering parameter. Another method includes initiating a thermal mitigation technique on a PCD and determining a current graphical load being processed by the PCD. A graphics feature associated with the current graphical load is identified. The graphics feature is then disabled while maintaining a frame rate to reduce temperature of the PCD.

Abstract: Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (“PoP”) memory temperatures and the “touch temperature” of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power.