Patents by Inventor Jonas Guebey

Jonas Guebey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160298249
    Abstract: Copper alloy electroplating baths include one or more sources of copper (I) ions and one or more sources of tin ions to electroplate copper/tin alloys of mirror bright white bronze. The copper alloys may also include one or more sources of silver ions to electroplate ternary alloys of bright white bronze containing copper/tin/silver. The copper alloy electroplating baths are cyanide-free.
    Type: Application
    Filed: September 30, 2014
    Publication date: October 13, 2016
    Inventors: Adolphe FOYET, Jonas GUEBEY, Margit CLAUSS
  • Patent number: 9435046
    Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
    Type: Grant
    Filed: June 22, 2013
    Date of Patent: September 6, 2016
    Inventors: Wan Zhang-Beglinger, Margit Clauss, Jonas Guebey, Felix J. Schwager
  • Patent number: 9267077
    Abstract: A chrome-free acidic aqueous solution of sulfuric acid and one or more organic acids and manganese (II) and (III) ions is applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: February 23, 2016
    Inventors: Katharina Weitershaus, Wan Zhang-Beglinger, Andreas Scheybal, Jonas Guebey
  • Patent number: 9145616
    Abstract: A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity.
    Type: Grant
    Filed: February 23, 2013
    Date of Patent: September 29, 2015
    Inventors: Adolphe Foyet, Wan Zhang-Beglinger, Michael P. Toben, Jonas Guebey
  • Patent number: 9145617
    Abstract: White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: September 29, 2015
    Inventors: Katharina Weitershaus, Wan Zhang-Beglinger, Jonas Guebey
  • Patent number: 8608931
    Abstract: Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: December 17, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Wan Zhang-Beglinger, Jonas Guebey, André Egli
  • Publication number: 20130284605
    Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
    Type: Application
    Filed: June 22, 2013
    Publication date: October 31, 2013
    Inventors: Wan ZHANG-BEGLINGER, Margit CLAUSS, Jonas GUEBEY, Felix J. SCHWAGER
  • Publication number: 20130236742
    Abstract: White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.
    Type: Application
    Filed: August 30, 2012
    Publication date: September 12, 2013
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Katharina WEITERSHAUS, Wan ZHANG-BEGLINGER, Jonas GUEBEY
  • Publication number: 20110147225
    Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
    Type: Application
    Filed: October 26, 2010
    Publication date: June 23, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Wan Zhang-Beglinger, Margit Clauss, Jonas Guebey, Felix J. Schwager
  • Publication number: 20110147220
    Abstract: Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.
    Type: Application
    Filed: September 22, 2010
    Publication date: June 23, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Wan Zhang-Beglinger, Jonas Guebey, André Egli
  • Publication number: 20090038950
    Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
    Type: Application
    Filed: July 21, 2008
    Publication date: February 12, 2009
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Wan Zhang-Beglinger, Margit Clauss, Jonas Guebey, Felix J. Schwager