Abstract: A system for forming an object having a three-dimensional structure, the system comprising: a container for providing a photo-curable material to be polymerized; a rotatable stage for supporting the container; a light source for providing light rays having at least one light pattern to be guided into the container via an optical assembly; a processing unit for determining the light source's degree of non-telecentricity, and determining an optimally pre-distorted set of the at least one light pattern based on at least the photo-curable material's refractive index; correcting at least one distortion of the light rays caused by refraction at the container interface and/or correcting at least one distortion of the light rays caused by non-telecentricity; and whereby the correction of the at least one distortion of the light rays is performed without altering the calibration of the optical assembly.

Abstract: An arrangement for optimizing a lithographic process forms a pattern on a silicon wafer using a photocluster cell system to simulate an actual processing condition for a semiconductor product. The resist pattern is then inspected using a wafer inspection system. An in-line low voltage scanning electron microscope (SEM) system reviews and classifies defect types, enabling generation of an alternative processing specification. The alternative processing specification can then be tested by forming patterns on different wafers, and then performing split-series testing to analyze the patterns on the different wafers for comparison with the existing lithographic process and qualification for production.

Abstract: An arrangement for optimizing a lithographic process forms a pattern on a silicon wafer using a photocluster cell system to simulate an actual processing condition for a semiconductor product. The resist pattern is then inspected using a wafer inspection system. An in-line low voltage scanning electron microscope (SEM) system reviews and classifies defect types, enabling generation of an alternative processing specification. The alternative processing specification can then be tested by forming patterns on different wafers, and then performing split-series testing to analyze the patterns on the different wafers for comparison with the existing lithographic process and qualification for production.