Patents by Inventor Jonathan Craig Whitcomb

Jonathan Craig Whitcomb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and process for improved die adhesion to organic chip carriers
    Patent number: 5955782
    Abstract: A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and attached to an organic card with the same passivation material. A semiconductor die may be adhered to the coated die bond pad with either the same passivation material or a common die bond adhesive. Alternatively, the passivation material is coated only on the portion of the die bond pad where the die is attached, and common die bond adhesive attaches the die bond pad to the organic card.
    Type: Grant
    Filed: November 4, 1997
    Date of Patent: September 21, 1999
    Assignee: International Business Machines Corporation
    Inventors: Stephen John Kosteva, David Michael Passante, William John Rudik, David John Russell, Jonathan Craig Whitcomb