Patents by Inventor Jonathan D. H. Hammond

Jonathan D. H. Hammond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for assembly and bonding of electronic components on an insulating support
    Patent number: 5510139
    Abstract: In a process for assembly and bonding of electric and/or electronic components (3), provided with metal connections (11), on an insulating support (1) to be provided with strip conductors, it is provided, to increase the economic efficiency, that a catalyst (7) for currentless metal deposition is applied on support (1) first in the area of the strip conductor structure, that components (2) are positioned with their metal connections (11) on the assigned strip conductor points of support (1) and that then, by currentless metal deposition from a chemical metallization bath, bonding (13, 14) of metal connections (11) is performed simultaneously with the formation of metallic strip conductors (5).
    Type: Grant
    Filed: October 14, 1993
    Date of Patent: April 23, 1996
    Assignee: AMEG Additive Metallisierung-Entwicklunge-und Anwendungssesellshaft GmbH
    Inventors: Erich Deissner, Jonathan D. H. Hammond, Dieter Meier