Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

Abstract: A method of fabricating an interconnect includes forming one or more holes in an anisotropic conductive film on a carrier substrate, filling at least one of the one or more holes with a material capable of transmitting an optical signal, and laminating the anisotropic conductive film on a packaging substrate. An electronic package includes a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect includes a conductive film for electrically coupling a first terminal formed on the first substrate to a second terminal formed on the second substrate, and one or more optically transmissive units embedded in the conductive film, wherein at least one of the one or more optically transmissive units provides an optical signal path between an optical element on the first substrate and an optical element on the second substrate.

Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoclectronic device via the light transmission medium.

Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

Abstract: An optical coupler for forming an optical connection between one or more two dimensional photonic array devices and an optical fiber and for forming an electrical connection between the two dimensional photonic array devices and a substrate, a system including the optical coupler and materials, and methods of forming the optical coupler and system are disclosed. The optical coupler includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes alignment guides configured to receive guide pins from a fiber optic connector, such that when the fiber optic connector is attached to the optical coupler, fibers of the ribbon align with the two dimensional photonic array device(s) via the light transmission medium.

Abstract: A method of fabricating an interconnect includes forming one or more holes in an anisotropic conductive film on a carrier substrate, filling at least one of the one or more holes with a material capable of transmitting an optical signal, and laminating the anisotropic conductive film on a packaging substrate. An electronic package includes a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect includes a conductive film for electrically coupling a first terminal formed on the first substrate to a second terminal formed on the second substrate, and one or more optically transmissive units embedded in the conductive film, wherein at least one of the one or more optically transmissive units provides an optical signal path between an optical element on the first substrate and an optical element on the second substrate.

Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber, forming an electrical connection between the optoelectronic device and an integrated circuit, and a forming an electrical connection between the microelectronic device and a substrate, a system including the device, and a method of forming the device and system are disclosed. The device for forming an optical connection includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector portion of a fiber ribbon cable assembly, such that when the fiber ribbon connector is attached to the device, the transmission medium provides an optical path between the optoelectronic device and the fiber.

Abstract: An interconnect comprising an anisotropic conductive film and an optically transmissive unit embedded in the anisotropic conductive film. The optically transmissive unit provides an optically transmissive path through the anisotropic conductive film. In an alternative embodiment, an electronic package comprises a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect comprises an anisotropic conductive film for electrically coupling a first conductive element formed on the first substrate to a second conductive element formed on the second substrate and one or more optically transmissive units embedded in the anisotropic conductive film. At least one of the one or more optically transmissive units couples an optical signal path on the first substrate to an optical receiver on the second substrate.

Abstract: An optical coupler for forming an optical connection between one or more two dimensional photonic array devices and an optical fiber and for forming an electrical connection between the two dimensional photonic array devices and a substrate, a system including the optical coupler and materials, and methods of forming the optical coupler and system are disclosed. The optical coupler includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes alignment guides configured to receive guide pins from a fiber optic connector, such that when the fiber optic connector is attached to the optical coupler, fibers of the ribbon align with the two dimensional photonic array device(s) via the light transmission medium.

Abstract: A system for transmitting information between a plurality of microelectronic devices is disclosed. The system includes a plurality of microelectronic devices coupled to an interconnect, which may be optical or electrical. The system may further include one or more switches to transfer information between the various microelectronic devices.

Abstract: An interconnect comprising an anisotropic conductive film and an optically transmissive unit embedded in the anisotropic conductive film. The optically transmissive unit provides an optically transmissive path through the anisotropic conductive film. In an alternative embodiment, an electronic package comprises a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect comprises an anisotropic conductive film for electrically coupling a first conductive element formed on the first substrate to a second conductive element formed on the second substrate and one or more optically transmissive units embedded in the anisotropic conductive film. At least one of the one or more optically transmissive units couples an optical signal path on the first substrate to an optical receiver on the second substrate.

Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber, forming an electrical connection between the optoelectronic device and an integrated circuit, and a forming an electrical connection between the microelectronic device and a substrate, a system including the device, and a method of forming the device and system are disclosed. The device for forming an optical connection includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector portion of a fiber ribbon cable assembly, such that when the fiber ribbon connector is attached to the device, the transmission medium provides an optical path between the optoelectronic device and the fiber.

Abstract: A stacked flip chip assembly that substantially enhances integrated circuit density and reliability in a multi chip module by electrically coupling a first die to a conductive surface of a substrate through a flip chip attachment. The assembly further includes electrically coupling a second die to the first die through the flip chip attachment such that the second die is disposed on the first die and across from the substrate. The assembly also includes a third die electrically coupled to the second die through the flip chip attachment such that the third die is disposed on the second die and across from the second die and the substrate. Further, the second and third dies are electrically coupled to the substrate through the first and second dies by having conductive redistribution traces on sides of the first and second dies to route electrical signals from the second and third dies to the substrate and vice versa.