Patents by Inventor Jonathan Meigs

Jonathan Meigs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit boards having integrated inductor cores
    Patent number: 6763575
    Abstract: A process for forming printed circuit boards having integral inductor cores. According to the invention, a thin nickel layer is formed on a copper foil. The copper foil structure is then laminated to a substrate such that the nickel layer is in contact with the substrate. The copper foil is removed, leaving the nickel layer on the substrate. Using photomechanical imaging and etching techniques known in the art, NiFe is plated and patterned directly on the nickel layer, thereby forming integral inductor cores of the substrate. This process of the present invention allows for the elimination of several steps used in known processes, while also reducing etch time and minimizing waste of NiFe.
    Type: Grant
    Filed: June 11, 2001
    Date of Patent: July 20, 2004
    Assignee: Oak-Mitsui Inc.
    Inventors: Jonathan Meigs, Wendy Herrick
  • Printed circuit boards having integrated inductor cores
    Publication number: 20020196119
    Abstract: A process for forming printed circuit boards having integral inductor cores. According to the invention, a thin nickel layer is formed on a copper foil. The copper foil structure is then laminated to a substrate such that the nickel layer is in contact with the substrate. The copper foil is removed, leaving the nickel layer on the substrate. Using photomechanical imaging and etching techniques known in the art, NiFe is plated and patterned directly on the nickel layer, thereby forming integral inductor cores of the substrate. This process of the present invention allows for the elimination of several steps used in known processes, while also reducing etch time and minimizing waste of NiFe.
    Type: Application
    Filed: June 11, 2001
    Publication date: December 26, 2002
    Applicant: OAK-MITSUI, Inc.
    Inventors: Jonathan Meigs, Wendy Herrick