Abstract: An Integrated Circuit (IC) package is provided, comprising a first IC die having a first capacitor and a logic circuit, and a second IC die having a second capacitor. The first IC die and the second IC die may be stacked within the IC package one on top of another and electrically coupled with die-to-die interconnects. The logic circuit is electrically coupled in a power delivery network to the first capacitor and the second capacitor. The first IC die and the second IC die include respective back-end-of-line portions in which the first capacitor and the second capacitor, which may comprise metal-insulator-metal capacitors in some embodiments are situated. In some embodiments, the second capacitor is situated in a shadow of the logic circuit. In various embodiments, the first IC die and the second IC die comprise any suitable pair in a plurality of stacked IC dies within an IC package.

Abstract: Embodiments disclosed herein include electronics packages with improved thermal pathways. In an embodiment, an electronics package includes a package substrate. In an embodiment, the package substrate comprises a plurality of backside layers, a plurality of front-side layers, and a core layer between the plurality of backside layers and the plurality of front-side layers. In an embodiment, an inductor is embedded in the plurality of backside layers. In an embodiment, a plurality of bumps are formed over the front-side layers and thermally coupled to the inductor. In an embodiment, the plurality of bumps are thermally coupled to the core layer by a plurality of vias.

Abstract: Circuitry to apply heat to a die while the die junction temperature is below a minimum die junction temperature of an operating die junction temperature range for the die is provided. The circuitry to avoid a system boot failure when the die junction temperature is below the operating die junction temperature range of the die.

Abstract: Circuitry to apply heat to a die while the die junction temperature is below a minimum die junction temperature of an operating die junction temperature range for the die is provided. The circuitry to avoid a system boot failure when the die junction temperature is below the operating die junction temperature range of the die.

Abstract: Embodiments disclosed herein include electronics packages with improved thermal pathways. In an embodiment, an electronics package includes a package substrate. In an embodiment, the package substrate comprises a plurality of backside layers, a plurality of front-side layers, and a core layer between the plurality of backside layers and the plurality of front-side layers. In an embodiment, an inductor is embedded in the plurality of backside layers. In an embodiment, a plurality of bumps are formed over the front-side layers and thermally coupled to the inductor. In an embodiment, the plurality of bumps are thermally coupled to the core layer by a plurality of vias.

Abstract: Techniques and mechanisms for mitigating an overshoot of a supply voltage provided with a voltage regulator (VR). In an embodiment, buck converter functionality of a VR is provided with first circuitry comprising a first inductor and first switch circuits variously coupled thereto. Second circuitry of the VR comprises a second inductor and second switch circuits variously coupled thereto. In response to an indication of a voltage overshoot condition, respective states of the first switch circuits and the second switch circuits are configured to enable a conductive path for dissipating energy with the first inductor, the second inductor, and various ones of the first switch circuits and the second switch circuits. In another embodiment, mitigating the voltage overshoot condition comprises alternately toggling between two different configurations of the second switch circuits.

Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) coupled to first one or more inductors, the first VR is to provide power to a first power domain; and a second VR coupled to second one or more inductors at least one of which is inductively coupled to at least one of the first one or more inductors, the second VR is to provide power to a second power domain separate from the first power domain, wherein there is a non-zero phase angle offset between switching transistors of the first VR relative to the second VR.

Abstract: Some embodiments include apparatuses and methods of using such apparatuses. One of the apparatuses includes voltage regulators in an integrated circuit device, and a frequency control block and a module included in the integrated circuit device. Each of the voltage regulators includes a current sensor. The frequency control block operates to provide a clock signal to each of the voltage regulators. The clock signal has a frequency based on digital information. The module operates to receive a current from the current sensor of each of the voltage regulators and provides the digital information to the frequency control block to control the frequency of the clock signal. The digital information has a value based on the current from each of the current sensors.

Abstract: Some embodiments include apparatuses and methods of using such apparatuses. One of the apparatuses includes voltage regulators in an integrated circuit device, and a frequency control block and a module included in the integrated circuit device. Each of the voltage regulators includes a current sensor. The frequency control block operates to provide a clock signal to each of the voltage regulators. The clock signal has a frequency based on digital information. The module operates to receive a current from the current sensor of each of the voltage regulators and provides the digital information to the frequency control block to control the frequency of the clock signal. The digital information has a value based on the current from each of the current sensors.

Abstract: Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.

Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) coupled to first one or more inductors, the first VR is to provide power to a first power domain; and a second VR coupled to second one or more inductors at least one of which is inductively coupled to at least one of the first one or more inductors, the second VR is to provide power to a second power domain separate from the first power domain, wherein there is a non-zero phase angle offset between switching transistors of the first VR relative to the second VR.

Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) coupled to first one or more inductors, the first VR is to provide power to a first power domain; and a second VR coupled to second one or more inductors at least one of which is inductively coupled to at least one of the first one or more inductors, the second VR is to provide power to a second power domain separate from the first power domain, wherein there is a non-zero phase angle offset between switching transistors of the first VR relative to the second VR.

Abstract: Described is an apparatus having a non-linear control to manage power supply droop at an output of a voltage regulator. The apparatus comprises: a first inductor for coupling to a load; a capacitor, coupled to the first inductor, and for coupling to the load; a first high-side switch couple to the first inductor; a first low-side switch coupled to the first inductor; a bridge controller to control when to turn on and off the first high-side and first low-side switches; and a non-linear control (NLC) unit to monitor output voltage on the load, and to cause the bridge controller to turn on the first high-side switch and turn off the first low-side switch when a voltage droop is detected on the load.

Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) coupled to first one or more inductors, the first VR is to provide power to a first power domain; and a second VR coupled to second one or more inductors at least one of which is inductively coupled to at least one of the first one or more inductors, the second VR is to provide power to a second power domain separate from the first power domain, wherein there is a non-zero phase angle offset between switching transistors of the first VR relative to the second VR.

Abstract: Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.

Abstract: Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.

Abstract: Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.

Abstract: Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.

Abstract: Described is an apparatus for providing spread-spectrum to a clock signal. The apparatus comprises: an oscillator to generate an output clock signal, the oscillator to receive an adjustable reference signal to adjust frequency of the output clock signal; a first circuit to provide a first signal indicative of a center frequency of the output clock signal; a second circuit to generate a switching waveform to provide spread-spectrum for the output clock signal; and a third circuit, coupled to the first and second circuits, to provide the adjustable reference signal according to the first signal and the switching waveform.

Abstract: Described is an apparatus having a non-linear control to manage power supply droop at an output of a voltage regulator. The apparatus comprises: a first inductor for coupling to a load; a capacitor, coupled to the first inductor, and for coupling to the load; a first high-side switch couple to the first inductor; a first low-side switch coupled to the first inductor; a bridge controller to control when to turn on and off the first high-side and first low-side switches; and a non-linear control (NLC) unit to monitor output voltage on the load, and to cause the bridge controller to turn on the first high-side switch and turn off the first low-side switch when a voltage droop is detected on the load.