Abstract: The present invention relates to coated binary and ternary chalcogenide nanoparticle compositions that can be used as copper zinc tin chalcogenide precursor inks. In addition, this invention relates to coated substrates comprising binary and ternary chalcogenide nanoparticle compositions and provides processes for manufacturing these coated substrates. This invention also relates to compositions of copper zinc tin chalcogenide thin films and photovoltaic cells comprising such films. In addition, this invention provides processes for manufacturing copper zinc tin chalcogenide thin films, as well as processes for manufacturing photovoltaic cells incorporating such films.

Abstract: The present invention relates to dispersible binary and ternary metal chalcogenide nanoparticle compositions that are substantially free of organic stabilizing agents. These nanoparticle compositions can be used as precursor inks for the preparation of copper zinc tin chalcogenides and copper indium gallium chalcogenides. In addition, this invention provides processes for manufacturing coated substrates and thin films of copper zinc tin chalcogenide and copper indium gallium chalcogenide. This invention also provides process for manufacturing photovoltaic cells incorporating such thin films.

Abstract: This invention provides compositions useful for preparing films of CZTS and its selenium analogues on a coated substrate. This invention also provides processes for preparing films and coated substrates comprising CZTS/Se microparticles embedded in an inorganic matrix. This invention also provides processes for preparing photovoltaic cells comprising films of CZTS and its selenium analogues.

Abstract: This invention relates to processes for preparing films of copper indium gallium sulfide/selenides (CIGS/Se) on substrates via inks comprising CIGS/Se microparticles and a plurality of particles. This invention relates to inks, coated layers, and film compositions. Such films are useful in the preparation of photovoltaic devices. This invention also relates to processes for preparing coated substrates and for making photovoltaic devices.

Abstract: This invention relates to inks comprising molecular precursors to copper indium gallium sulfide/selenide (CIGS/Se) and a plurality of particles. The inks are useful for preparing coatings and films of CIGS/Se on substrates. Such films are useful in the preparation of photovoltaic devices. This invention also relates to processes for preparing coated substrates and films and also to processes for making photovoltaic devices.

Abstract: The present invention relates to coated binary and ternary chalcogenide nanoparticle compositions that can be used as copper zinc tin chalcogenide precursor inks. In addition, this invention relates to coated substrates comprising binary and ternary chalcogenide nanoparticle compositions and provides processes for manufacturing these coated substrates. This invention also relates to compositions of copper zinc tin chalcogenide thin films and photovoltaic cells comprising such films. In addition, this invention provides processes for manufacturing copper zinc tin chalcogenide thin films, as well as processes for manufacturing photovoltaic cells incorporating such films.

Abstract: Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.

Abstract: A method for thermal mass transfer comprises providing a donor element with a support having a thickness (h) and a modulus (E), an adjacent transfer layer and a receiver element, wherein the receiver element is contacted with the transfer layer to form an assemblage. An imaging head having three or more beams of light is moved relative to the assemblage to cause imagewise mass transfer of the transfer layer onto the receiver element in a local pattern of three or more areas, each area having a local width (b) and local separation (2a) distinct from any adjacent local area, wherein when the modulus is greater than 1.5 and less than or equal to 5 gPa and the local width (b) is less than or equal to 250 microns and the local separation (2a) is less than or equal to 300 microns, the support layer thickness (h) is less than or equal to 45 microns; and wherein when the modulus is greater than 0.05 and less than or equal to 1.

Abstract: This invention relates to nanoparticles of kesterite (copper zinc tin sulfide) and copper zinc tin selenide nanoparticles, inks and devices thereof, and processes to prepare same. The nano-particles are useful to for the absorber layer as a p-type semiconductor in a thin film solar cell application.

Abstract: Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.

Abstract: Metal compositions including silver compositions are used in preparing thermal imaging donors. The donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Abstract: A multi-channel imaging head is calibrated in accordance with a pre-determined regular pattern to minimize swath-to-swath and inter-swath variations during the imaging of the regular pattern. The imaging parameters of the imaging head are optimized in accordance with the pre-determined regular pattern.

Abstract: The invention is related to thermal imageable dielectric layers and thermal transfer donors and receivers comprising dielectric layers. The thermal transfer donors are useful in making electronic devices by thermal transfer of dielectric layers having excellent resistivity, good transfer properties and good adhesion to a variety of receivers.

Abstract: The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.

Abstract: Two or more sets of non-contiguous features are selected from a pattern of non-contiguous features, and each set is imaged separately during a single scan of a multi-channel imaging head. The non-contiguous features selected in each set can be selected such that they are imaged with substantially the same transferred characteristics. The non-contiguous features selected in all the sets can be selected such that the pattern is completely imaged after all of the sets have been separately imaged, and each imaged non-contiguous feature in the completely imaged pattern has substantially the same imaged characteristics. The one or more sets can be selected such that the selected non-contiguous features of one set are interleaved with the selected non-contiguous features of another set.

Abstract: The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Abstract: Methods for imaging regular patterns are provided. A multi-channel imaging head is configured in accordance with the repeat of a pre-determined regular pattern such that no swath boundaries appear within the visibly imaged features of the pattern. The imaged articles have reduced visible banding due to the elimination of swath boundaries in the imaged features.

Abstract: The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Abstract: A multi-channel imaging head is calibrated in accordance with a pre-determined regular pattern to minimize swath-to-swath and inter-swath variations during the imaging of the regular pattern. The imaging parameters of the imaging head are optimized in accordance with the pre-determined regular pattern.

Abstract: The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.