Abstract: A cable assembly is described that includes a preterminated optical fiber drop cable having a connector body mounted on a terminal end thereof, and a removable installation device attached to a jacket of the preterminated optical fiber drop cable by an attachment portion, wherein the attachment portion includes a pair of tear tabs that provides tool-less removal of the installation device from the preterminated optical fiber drop cable.

Abstract: A modular fiber frame is disclosed that comprises a generally rectangular frame body, a high density connection module attached to a front side of the frame body, a splitter bracket to hold a plurality of optical splitter modules on the front side of the frame body. All of the splitter connections can be made on the front side of the modular fiber frame, and a preterminated cable harness optically connected to connection ports on a back of the connection module, wherein the connection module includes a protective cover over said connection ports. In some embodiments, the exemplary modular fiber frame can utilize a second preterminated cable harness optically connected to a back of the connection module.

Abstract: A cable assembly is described that includes a preterminated optical fiber drop cable having a connector body mounted on a terminal end thereof, and a removable installation device attached to a jacket of the preterminated optical fiber drop cable by an attachment portion, wherein the attachment portion includes a pair of tear tabs that provides tool-less removal of the installation device from the preterminated optical fiber drop cable.

Abstract: A cable assembly is described that includes a preterminated optical fiber drop cable having a connector body mounted on a terminal end thereof, and a removable installation device attached to a jacket of the preterminated optical fiber drop cable by an attachment portion, wherein the attachment portion includes a pair of tear tabs that provides tool-less removal of the installation device from the preterminated optical fiber drop cable.

Abstract: A modular fiber frame is disclosed that comprises a generally rectangular frame body, a high density connection module attached to a front side of the frame body, a splitter bracket to hold a plurality of optical splitter modules on the front side of the frame body. All of the splitter connections can be made on the front side of the modular fiber frame, and a preterminated cable harness optically connected to connection ports on a back of the connection module, wherein the connection module includes a protective cover over said connection ports. In some embodiments, the exemplary modular fiber frame can utilize a second preterminated cable harness optically connected to a back of the connection module.

Abstract: A cable assembly is described that includes a preterminated optical fiber drop cable having a connector body mounted on a terminal end thereof, and a removable installation device attached to a jacket of the preterminated optical fiber drop cable by an attachment portion, wherein the attachment portion includes a pair of tear tabs that provides tool-less removal of the installation device from the preterminated optical fiber drop cable.

Abstract: A vacuum collet includes at least one weight disposed in the collet for assisting in removal of components from the collet. The weights are movable within the collet to gently dislodge components lodged on a bottom face of the collet. The weights may be actuated by the same vacuum which draws components to the collet.

Abstract: A semiconductor chip transferring method and apparatus is described having a movable member, a flexible structure having adhesive on a lower surface thereof, a first transport assembly, and a second transport assembly. The first transport assembly is positioned beneath the support structure and includes a rotatable base upon which is mounted at least one arm. The movable member is extended into and flexes the support structure to transfer a semiconductor chip supported on a first side by the support structure to the arm which supports it on a second side. The first transport assembly moves the chip to the second transport assembly which may, in turn, move it to an output container which supports the second side. The chip has now been inverted from its initial orientation.

Abstract: A vacuum collet includes a filament disposed in the collet for assisting in removal of components from the collet. The filament is movable in a vertical direction within the collet to gently dislodge components lodged on a bottom face of the collet. The filament may be actuated by a solenoid or pneumatic or hydraulic actuator.