Abstract: A high density electrical connector of the present invention comprises a dielectric housing having a pair of retaining walls rearwardly extending therefrom, a contact module assembly received between the retaining walls, a metallic shield covering a front side of the housing, a pair of grounding portions received in the housing and a pair of metallic attaching portions for electrically connecting the shield to the grounding portion and thence to ground. The attaching portions each have a block which forms a shoulder on a lateral end thereof and a tubular part forwardly depending from the block. In assembly, the shoulders press against joining plates of the grounding portions which are supported by the retaining walls thereby guiding the tubular part and correcting offset of the grounding portions. The shoulders press against the joining plates further preventing the attaching portions from relaxing out of position after assembly. Therefore, assembly efficiency is increased.

Abstract: A casing for enclosing a circuit board comprises pair of symmetrical halves assembled together. Each said half forms plurality of retaining means on a first longitudinal side thereof and plurality of receiving means at a second longitudinal side opposite said first longitudinal side whereby said halves are fixedly assembled together by the interlocking engagement between said retaining means and said receiving means.