Patents by Inventor Jong-Ah Paik

Jong-Ah Paik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SKUTTERUDITE THERMOELECTRIC MATERIALS AND METHODS FOR MAKING
    Publication number: 20170194546
    Abstract: The present invention provides a thermoelectric device. The thermoelectric device includes an interconnect layer, a skutterudite layer, and a metallization stack. The metallization stack, having a diffusion layer, is disposed between and in electrical contact with the interconnect layer and the skutterudite layer of the thermoelectric device. The present invention also provides a method of preparing an SKD thermocouple. The present invention also provides a method of preparing a braze joint.
    Type: Application
    Filed: January 4, 2017
    Publication date: July 6, 2017
    Applicant: California Institute of Technology
    Inventors: Samad A. Fidrosy, Jong-Ah Paik, Kevin L. Smith, Billy Chun-Yip Li, Su C. Chi, Kevin Yu, Jean-Pierre Fleurial, David M. Uhl, Thierry Caillat, George H. Nakasukasa, Vilapanur A. Ravi
  • Alumina paste sublimation suppression barrier for thermoelectric device
    Patent number: 8791353
    Abstract: Alumina as a sublimation suppression barrier for a Zintl thermoelectric material in a thermoelectric power generation device operating at high temperature, e.g. at or above 1000K, is disclosed. The Zintl thermoelectric material may comprise Yb14MnSb11. The alumina may be applied as an adhesive paste dried and cured on a substantially oxide free surface of the Zintl thermoelectric material and polished to a final thickness. The sublimation suppression barrier may be finalized by baking out the alumina layer on the Zintl thermoelectric material until it becomes substantially clogged with ytterbia.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: July 29, 2014
    Assignee: California Institute of Technology
    Inventors: Jong-Ah Paik, Thierry Caillat
  • ALUMINA PASTE SUBLIMATION SUPPRESSION BARRIER FOR THERMOELECTRIC DEVICE
    Publication number: 20100229910
    Abstract: Alumina as a sublimation suppression barrier for a Zintl thermoelectric material in a thermoelectric power generation device operating at high temperature, e.g. at or above 1000K, is disclosed. The Zintl thermoelectric material may comprise Yb14MnSb11. The alumina may be applied as an adhesive paste dried and cured on a substantially oxide free surface of the Zintl thermoelectric material and polished to a final thickness. The sublimation suppression barrier may be finalized by baking out the alumina layer on the Zintl thermoelectric material until it becomes substantially clogged with ytterbia.
    Type: Application
    Filed: March 12, 2010
    Publication date: September 16, 2010
    Applicant: California Institute of Technology
    Inventors: Jong-Ah Paik, Thierry Caillat