Abstract: A semiconductor package includes a first package substrate having a first region and a second region, which do not overlap each other, a first connection element having a first height on the first region, a first semiconductor chip having a second height connected to the first connection element, a second connection element having a third height on the second region, a third connection element having a fourth height on the second connection element and electrically connected to the second connection element, a second package on the third connection element, the second package including a second package substrate and a second semiconductor chip, and a first mold layer covering at least a portion of the first semiconductor chip, covering at least a portion of the second connection element, covering the first package substrate, exposing upper surfaces of the first semiconductor chip and the second connection element, and having a fifth height.

Abstract: The present disclosure relates to a busbar unit for a motor, the busbar unit including: a first terminal; a second terminal provided to be spaced apart from the first terminal in a first direction; a third terminal stacked on the first terminal in a second direction perpendicular to the first direction; a fourth terminal stacked on the second terminal in the second direction; and a holder configured to support the first terminal, the second terminal, the third terminal, and the fourth terminal, thereby obtaining an advantageous effect of simplifying a structure and improving a degree of design freedom and spatial utilization.

Abstract: A semiconductor package includes a first package substrate having a first area and a second area that is distinct and separate from the first area, a first connection element disposed on the first area and having a first thickness, a first semiconductor chip connected to the first connection element, a second connection element disposed on the second area and having a second thickness that is greater than the first thickness, a third connection element disposed on the second connection element and electrically connected to the second connection element, a second package substrate disposed on the third connection element, and a second semiconductor chip disposed on the second package substrate.

Abstract: Disclosed is a video surveillance technique for performing automated surveillance through intelligent video recognition. A distance between two persons is measured from an image captured by a camera. When the measured distance is less than or equal to a reference value, a proximity event occurs. In an embodiment, feet of two persons are detected from an image captured by a camera and a distance between the two persons is calculated using a distance between positions on the ground at which the feet are placed by using camera parameters. In another embodiment, heads of two persons are detected from an image captured by a camera and a distance between the two persons is calculated using a distance between positions of the heads on a plane corresponding to an average height.

Abstract: The present invention relates to a device and method for detecting a three-dimensional object using a plurality of cameras that are capable of simply detecting a three-dimensional object. The device comprises: a planarization unit for planarizing, through homography conversion, each input image obtained by the plurality of cameras; a comparison-area selecting unit for selecting each area to be compared after adjusting the offset of a camera in order to overlay a plurality of images which have been planarized by said planarization unit; a comparison-processing unit for determining whether or not corresponding pixels are identical in the comparison area selected by said comparison-area selecting unit, and generating a single image based on the results of the determination; and an object-detecting unit for detecting a three-dimensional object disposed on the ground by analyzing the form of the single image generated by said comparison-processing unit.